Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
0369200305

0369200305

Woodhead - Molex

PICO-EZMATE CABLE ASSY 450MM 3PO

0

0151370602

0151370602

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

17

2153281081

2153281081

Woodhead - Molex

MINIFIT JR DR P-S 8 CIRCUIT 150M

0

0151310401

0151310401

Woodhead - Molex

CABLE-ASSY PICOLOCK 4 CIRCUIT 10

552

2162711052

2162711052

Woodhead - Molex

SL POSITIVE LOCK R-S 5CKT 150MM

0

0369200601

0369200601

Woodhead - Molex

PICOEZMATE 6 CIRCUIT 100MM

1985

2164011031

2164011031

Woodhead - Molex

MEGAFIT SR R-S 3 CKT 150 MM CABL

0

0451420310

0451420310

Woodhead - Molex

FCT 3 CKT CPA MULTICAT 1000MM AW

10

2162721033

2162721033

Woodhead - Molex

SL POSITIVE LOCK P-P 3CKT 300MM

0

0451300203

0451300203

Woodhead - Molex

NANO-FIT 2 CIRCUIT 300M

1428

0151340402

0151340402

Woodhead - Molex

PICOBLADE 4 CIRCUIT 150MM

1059

0511100850-40-A-6-Z

0511100850-40-A-6-Z

Woodhead - Molex

8 CIRC CABLE ASSY 40" Z

35

0151341403

0151341403

Woodhead - Molex

PICOBLADE 14 CIRCUIT 300MM

363

0151320402

0151320402

Woodhead - Molex

CABLE ASSY PICOLOCK 4 POS 150MM

888

0451410401

0451410401

Woodhead - Molex

FCT 4 CKT CPA MULTICAT 300MM AWG

10

1451300600

1451300600

Woodhead - Molex

NANO-FIT-TO-NANO-FIT OFF-THE-SHE

65

0151340506

0151340506

Woodhead - Molex

PICOBLADE 5 CIRCUIT 600MM

0

0151350505

0151350505

Woodhead - Molex

CLICKMATE 5 CIRCUIT 450MM

0

2162911013

2162911013

Woodhead - Molex

STANDARD .093 1 CIRCUIT R TO S 6

0

0511100850-10-A-6-Y

0511100850-10-A-6-Y

Woodhead - Molex

8 CIRC CABLE ASSY 10" Y

46

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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