Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3DDK-1436R

M3DDK-1436R

3M

IDC CABLE - MKR14K/MC14M/MKR14K

0

M3WWK-6420K

M3WWK-6420K

3M

IDC CABLE - MPL64K/MC64F/MPL64K

0

M3CEK-2618R

M3CEK-2618R

3M

IDC CABLE - MKC26K/MC26M/MCE26K

0

M3DDA-2636J

M3DDA-2636J

3M

IDC CABLE - MKR26A/MC26G/MKR26A

0

M3BBA-2418R

M3BBA-2418R

3M

IDC CABLE - MSR24A/MC24M/MSR24A

0

M1AXK-3436R

M1AXK-3436R

3M

IDC CABLE - MSC34K/MC34M/X

0

M3DMK-1618J

M3DMK-1618J

3M

IDC CABLE - MKR16K/MC16G/MCG16K

0

M3RRK-1618J

M3RRK-1618J

3M

IDC CABLE - MPR16K/MC16G/MPR16K

0

M3AEK-5036J

M3AEK-5036J

3M

IDC CABLE - MSC50K/MC50G/MCE50K

0

M3CWK-5018J

M3CWK-5018J

3M

IDC CABLE - MKC50K/MC50G/MPL50K

0

M3AAA-2018R

M3AAA-2018R

3M

IDC CABLE - MSC20A/MC20M/MSC20A

0

M3FFK-3436J

M3FFK-3436J

3M

IDC CABLE - MCF34K/MC34G/MCF34K

0

M3EEK-1060K

M3EEK-1060K

3M

IDC CABLE - MCE10K/MC10F/MCE10K

0

M3TGK-2006J

M3TGK-2006J

3M

IDC CABLE - MSD20K/MC20G/MCS20K

0

D89116-0131HK-3365/16-D-6

D89116-0131HK-3365/16-D-6

3M

CABLE 16POS SOCKET TO SOCKET 6"

0

M3UYK-5018R

M3UYK-5018R

3M

IDC CABLE - MKS50K/MC50M/MPD50K

0

M3CFK-5020K

M3CFK-5020K

3M

IDC CABLE - MKC50K/MC50F/MCF50K

0

M3CCA-2018J

M3CCA-2018J

3M

IDC CABLE - MKC20A/MC20G/MKC20A

0

M3CKK-2020K

M3CKK-2020K

3M

IDC CABLE - MKC20K/MC20F/MPK20K

0

45120-010030-7700/20-F-06

45120-010030-7700/20-F-06

3M

CABLE ASSY 20 POS 6" PINOUT-F

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top