Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3UUK-1420K

M3UUK-1420K

3M

IDC CABLE - MKS14K/MC14F/MKS14K

0

M3WWK-3606R

M3WWK-3606R

3M

IDC CABLE - MPL36K/MC37M/MPL36K

0

M3UMK-1606R

M3UMK-1606R

3M

IDC CABLE - MKS16K/MC16M/MCG16K

0

M3CCK-3460K

M3CCK-3460K

3M

IDC CABLE - MKC34K/MC34F/MKC34K

0

M1KXK-2036J

M1KXK-2036J

3M

IDC CABLE - MPK20K/MC20G/X

0

M3TTK-3436J

M3TTK-3436J

3M

IDC CABLE - MSD34K/MC34G/MSD34K

0

M3AGK-3436J

M3AGK-3436J

3M

IDC CABLE - MSC34K/MC34G/MCS34K

0

45112-010030-3749/12-S-6

45112-010030-3749/12-S-6

3M

SGL END CBL ASSY 12POS SKT 6"

57

M3TKK-6018R

M3TKK-6018R

3M

IDC CABLE - MSD60K/MC60M/MPK60K

0

M3WWK-2636R

M3WWK-2636R

3M

IDC CABLE - MPL26K/MC26M/MPL26K

0

158210-0120-HF625/10-S-6

158210-0120-HF625/10-S-6

3M

SINGLE ENDED CABLE ASSEMBLY 10 P

0

M3DEK-3406J

M3DEK-3406J

3M

IDC CABLE - MKR34K/MC34G/MCE34K

0

M1WXK-1436J

M1WXK-1436J

3M

IDC CABLE - MPL14K/MC14G/X

0

M3CCK-2636J

M3CCK-2636J

3M

IDC CABLE - MKC26K/MC26G/MKC26K

0

M3WWK-2618R

M3WWK-2618R

3M

IDC CABLE - MPL26K/MC26M/MPL26K

0

M3TKK-2018R

M3TKK-2018R

3M

IDC CABLE - MSD20K/MC20M/MPK20K

0

M3CCK-6018R

M3CCK-6018R

3M

IDC CABLE - MKC60K/MC60M/MKC60K

0

M3BRK-4018R

M3BRK-4018R

3M

IDC CABLE - MSR40K/MC40M/MPR40K

0

M3BRK-4020K

M3BRK-4020K

3M

IDC CABLE - MSR40K/MC40F/MPR40K

0

M3CCK-5060K

M3CCK-5060K

3M

IDC CABLE - MKC50K/MC50F/MKC50K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top