Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H1WXH-6036M

H1WXH-6036M

ASSMANN WSW Components

IDC CBL - HHPL60H/AE60M/X

0

H3BWH-2636M

H3BWH-2636M

ASSMANN WSW Components

IDC CBL - HHSR26H/AE26M/HHPL26H

0

H3AAS-1406M

H3AAS-1406M

ASSMANN WSW Components

IDC CBL - HHSC14S/AE14M/HHSC14S

0

H1KXH-5036G

H1KXH-5036G

ASSMANN WSW Components

IDC CBL - HHPK50H/AE50G/X

0

H8MMS-5036M

H8MMS-5036M

ASSMANN WSW Components

DIP CBL - HHDM50S/AE50M/HHDM50S

0

H3DWH-6006M

H3DWH-6006M

ASSMANN WSW Components

IDC CBL - HHKR60H/AE60M/HHPL60H

0

H3DDS-1606G

H3DDS-1606G

ASSMANN WSW Components

IDC CBL - HHKR16S/AE16G/HHKR16S

0

H8MMH-2418G

H8MMH-2418G

ASSMANN WSW Components

DIP CABLE - HDM24H/AE24G/HDM24H

0

H2MXS-5006M

H2MXS-5006M

ASSMANN WSW Components

DIP CBL - HHDM50S/AE50M/X

0

H4PXS-2436M

H4PXS-2436M

ASSMANN WSW Components

DIP CABLE - HDP24S/AE24M/X

0

H6MMS-3406M

H6MMS-3406M

ASSMANN WSW Components

DIP CBL - HHDM34S/AE34M/HHDM34S

0

H6MMS-1606M

H6MMS-1606M

ASSMANN WSW Components

DIP CBL - HHDM16S/AE16M/HHDM16S

0

H3BWH-3418M

H3BWH-3418M

ASSMANN WSW Components

IDC CBL - HHSR34H/AE34M/HHPL34H

0

H3WWH-2018G

H3WWH-2018G

ASSMANN WSW Components

IDC CBL - HHPL20H/AE20G/HHPL20H

0

H3CCH-4006G

H3CCH-4006G

ASSMANN WSW Components

IDC CBL - HHKC40H/AE40G/HHKC40H

0

H3BBS-1006G

H3BBS-1006G

ASSMANN WSW Components

IDC CBL - HHSR10S/AE10G/HHSR10S

0

H2MXH-1618G

H2MXH-1618G

ASSMANN WSW Components

DIP CABLE - HDM16H/AE16G/X

0

H4PXH-2406G

H4PXH-2406G

ASSMANN WSW Components

DIP CABLE - HDP24H/AE24G/X

0

H4PXS-4018M

H4PXS-4018M

ASSMANN WSW Components

DIP CABLE - HDP40S/AE40M/X

0

H2MXH-2618G

H2MXH-2618G

ASSMANN WSW Components

DIP CABLE - HDM26H/AE26G/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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