Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H3AKH-1018G

H3AKH-1018G

ASSMANN WSW Components

IDC CBL - HHSC10H/AE10G/HHPK10H

0

H1DXS-3436G

H1DXS-3436G

ASSMANN WSW Components

IDC CBL - HHKR34S/AE34G/X

0

H3KKH-1618M

H3KKH-1618M

ASSMANN WSW Components

IDC CBL - HHPK16H/AE16M/HHPK16H

0

H2MXH-3406M

H2MXH-3406M

ASSMANN WSW Components

DIP CABLE - HDM34H/AE34M/X

0

H1WXH-2636G

H1WXH-2636G

ASSMANN WSW Components

IDC CBL - HHPL26H/AE26G/X

0

H8MMH-2018M

H8MMH-2018M

ASSMANN WSW Components

DIP CABLE - HDM20H/AE20M/HDM20H

0

H2MXH-3006M

H2MXH-3006M

ASSMANN WSW Components

DIP CABLE - HDM30H/AE30M/X

0

H3CCH-4036M

H3CCH-4036M

ASSMANN WSW Components

IDC CBL - HHKC40H/AE40M/HHKC40H

0

H3DWH-3418M

H3DWH-3418M

ASSMANN WSW Components

IDC CBL - HHKR34H/AE34M/HHPL34H

0

H3DKH-4006M

H3DKH-4006M

ASSMANN WSW Components

IDC CBL - HHKR40H/AE40M/HHPK40H

0

H6MMS-2006M

H6MMS-2006M

ASSMANN WSW Components

DIP CBL - HHDM20S/AE20M/HHDM20S

0

H3CCS-1036M

H3CCS-1036M

ASSMANN WSW Components

IDC CBL - HHKC10S/AE10M/HHKC10S

0

H3DKH-1618G

H3DKH-1618G

ASSMANN WSW Components

IDC CBL - HHKR16H/AE16G/HHPK16H

0

H3KKH-6036G

H3KKH-6036G

ASSMANN WSW Components

IDC CBL - HHPK60H/AE60G/HHPK60H

0

H0PPS-1636G

H0PPS-1636G

ASSMANN WSW Components

DIP CABLE - HDP16S/AE16G/HDP16S

0

H3BWH-2618G

H3BWH-2618G

ASSMANN WSW Components

IDC CBL - HHSR26H/AE26G/HHPL26H

0

H3KKH-1018M

H3KKH-1018M

ASSMANN WSW Components

IDC CBL - HHPK10H/AE10M/HHPK10H

0

H3DWH-4036G

H3DWH-4036G

ASSMANN WSW Components

IDC CBL - HHKR40H/AE40G/HHPL40H

0

H3CCH-3036M

H3CCH-3036M

ASSMANN WSW Components

IDC CBL - HHKC30H/AE30M/HHKC30H

0

H1AXH-4036G

H1AXH-4036G

ASSMANN WSW Components

IDC CBL - HHSC40H/AE40G/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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