Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
NBR-0005

NBR-0005

Pi Supply

NEBRA IP67 CASE

27

PIS-0496

PIS-0496

Pi Supply

MODMYPI PI ZERO CASE - BLACK

40

PIS-0555

PIS-0555

Pi Supply

FLICK ZERO CASE

40

PIS-1188

PIS-1188

Pi Supply

NATUREBYTES WILDLIFE CAMERA CASE

13

PIS-0590

PIS-0590

Pi Supply

FLIRC RASPBERRY PI 3 CASE

55

PIS-0556

PIS-0556

Pi Supply

FLICK HAT CASE

44

PIS-0557

PIS-0557

Pi Supply

FLICK LARGE CASE

34

PIS-1573

PIS-1573

Pi Supply

NEBRA IP67 CASE - GATEWAY HAT MO

42

JBM-027

JBM-027

Pi Supply

JUSTBOOM DAC ZERO CASE - RED

35

JBM-029

JBM-029

Pi Supply

JUSTBOOM AMP ZERO CASE - RED

45

PIS-0911

PIS-0911

Pi Supply

SNESPI CASE FOR RASPBERRY PI 3 (

18

JBM-026

JBM-026

Pi Supply

JUSTBOOM AMP HAT CASE - RED

45

JBM-028

JBM-028

Pi Supply

JUSTBOOM DIGI ZERO CASE - RED

40

PIS-1442

PIS-1442

Pi Supply

RAKBOX-NTS TRACKER ENCLOSURE WIT

9

PIS-0497

PIS-0497

Pi Supply

MODMYPI PI ZERO CASE - BLUE

101

PIS-0499

PIS-0499

Pi Supply

MODMYPI PI ZERO CASE - CLEAR

99

JBM-025

JBM-025

Pi Supply

JUSTBOOM DIGI HAT CASE - RED

42

PIS-1443

PIS-1443

Pi Supply

RAKBOX-GW OUTDOOR GATEWAY ENCLOS

11

PIS-1441

PIS-1441

Pi Supply

RAKBOX-NT TRACKER ENCLOSURE

10

JBM-024

JBM-024

Pi Supply

JUSTBOOM DAC HAT CASE - RED

36

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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