Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
JBM-030

JBM-030

Pi Supply

JUSTBOOM DAC AND AMP CASE - RED

44

PIS-0908

PIS-0908

Pi Supply

NESPI CASE+ WITH COOLING FAN, HE

23

PIS-0433

PIS-0433

Pi Supply

PAPIRUS ZERO CASE

0

JBM-011

JBM-011

Pi Supply

JUSTBOOM AMP HAT CASE - BLACK

0

JBM-013

JBM-013

Pi Supply

JUSTBOOM DIGI ZERO CASE - BLACK

0

PIS-0157

PIS-0157

Pi Supply

TOUCHSCREEN CASE 7INCH

0

PIS-0495

PIS-0495

Pi Supply

MODMYPI PI ZERO CASE - GREEN

0

JBM-009

JBM-009

Pi Supply

JUSTBOOM DAC HAT CASE - BLACK

0

JBM-012

JBM-012

Pi Supply

JUSTBOOM DAC ZERO CASE - BLACK

0

PIS-0498

PIS-0498

Pi Supply

MODMYPI PI ZERO CASE - WHITE

0

PIS-0604

PIS-0604

Pi Supply

PIJUICE TALL CASE

0

PIS-0166

PIS-0166

Pi Supply

SHORT CRUST PLUS - THE PERFECT B

0

JBM-015

JBM-015

Pi Supply

JUSTBOOM DAC AND AMP CASE - BLAC

0

PIS-0605

PIS-0605

Pi Supply

PIJUICE SHORT CASE

0

JBM-010

JBM-010

Pi Supply

JUSTBOOM DIGI HAT CASE - BLACK

0

PIS-0411

PIS-0411

Pi Supply

PAPIRUS HAT CASE

0

PIS-1592

PIS-1592

Pi Supply

RAKBOX-GW OUTDOOR ENCLOSURE

0

PIS-1186

PIS-1186

Pi Supply

PI SUPPLY PI ZERO CASE

0

RPI-034

RPI-034

Pi Supply

OFFICIAL RASPBERRY PI ZERO CASE

0

JBM-014

JBM-014

Pi Supply

JUSTBOOM AMP ZERO CASE - BLACK

0

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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