Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
3963

3963

Adafruit

NEOTRELLIS M4 ACRYLIC ENCLOSURE

3

3597

3597

Adafruit

BOX CLEAR 3"L X 2.4"W

194

4490

4490

Adafruit

UNO BOX CLEAR - LEGO COMPATIBLE

65

2250

2250

Adafruit

BOX PLSTC ORANGE 3.62" LX2.48" W

2

4822

4822

Adafruit

FLIRC ALUMINUM CASE FOR RASPBERR

45

4487

4487

Adafruit

SMOKE SNAP-ON CASE FOR MICRO:BIT

18

3770

3770

Adafruit

KITTENBOT SILICONE SLEEVE

0

4852

4852

Adafruit

SMOKE SNAP-ON CASE FOR MICRO:BIT

47

4341

4341

Adafruit

HEATSINK RAS PI 4 CASE NO FANS

0

3005

3005

Adafruit

BOX PLASTIC MULTIPLE

0

2258

2258

Adafruit

BOX POLYCARBONATE SMOKE 3.7X2.5"

47

1810

1810

Adafruit

BOX ALUM NATURAL 3.62"L X 2.52"W

1

1471

1471

Adafruit

LARGE TIN WITH CLEAR TOP WINDOW

0

2334

2334

Adafruit

BOX PLASTIC RED 3.62" LX2.48" W

0

4486

4486

Adafruit

TRANSLUCENT CASE FOR MICRO:BIT

0

2359

2359

Adafruit

RASPBERRY PI A+ CASE - SMOKE BAS

0

4372

4372

Adafruit

8X8 TRELLIS FEATHER M4 ENCLOSURE

0

4553

4553

Adafruit

FLIRC ALUMINUM CASE FOR RPI 4

0

2347

2347

Adafruit

BLACK CASE W/ SMOKEY TOP RAS PI

0

3771

3771

Adafruit

KITTENBOT SILICONE SLEEVE

0

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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