Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
3253

3253

Adafruit

BOX PLSTC BLK/CLR 1.97"LX1.22"W

219

4283

4283

Adafruit

PILOT GATEWAY PRO LORA ENCLOSURE

0

4301

4301

Adafruit

OFFICIAL RASPBERRY PI FOUNDATION

0

2779

2779

Adafruit

BOX PLSTC BLU/CLR 3.9"LX2.59"W

0

3773

3773

Adafruit

KITTENBOT SILICONE SLEEVE

0

2081

2081

Adafruit

ENCLOSURE FOR RASPBERRY PI

0

3915

3915

Adafruit

CIRCUIT PLAYGROUND EXPRESS ENCLO

55

2249

2249

Adafruit

BOX PLSTC YELLOW 3.62" LX2.48" W

1

3772

3772

Adafruit

KITTENBOT SILICONE SLEEVE

0

2253

2253

Adafruit

BOX PLSTC CLEAR 3.62" LX2.48" W

0

2883

2883

Adafruit

BOX PLSTC CLEAR 2.58"LX1.2"W

0

4131

4131

Adafruit

ELEMENT14 DESKTOP ENCLOSURE KIT

0

1555

1555

Adafruit

BOX PLSTC BLACK/CLR 3.6"LX2.5"W

0

3252

3252

Adafruit

BOX PLSTC BLK/CLR 2.76"LX1.38"W

0

2252

2252

Adafruit

BOX PLASTIC BLUE 3.62" LX2.48" W

0

3774

3774

Adafruit

KITTENBOT SILICONE SLEEVE

0

3062

3062

Adafruit

BOX PLSTC CLR/BLK 3.54"LX2.56"W

0

4339

4339

Adafruit

4X4 TRELLIS FEATHER ACRYLIC ENCL

40

3288

3288

Adafruit

BOX ABS CLEAR 2.91" L X 1.54" W

0

4340

4340

Adafruit

HEATSINK RAS PI 4 CASE W/2 FANS

92

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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