Evaluation, Development Board Enclosures

Image Part Number Description / PDF Quantity Rfq
1593HAMUNOGY

1593HAMUNOGY

Hammond Manufacturing

BOX ABS GRAY 4.38"L X 2.95"W

0

3496

3496

Adafruit

HOUSING ALUM BLUE 2.3"L X 1.9"W

0

102060000

102060000

Seeed

BOX PLASTIC GRY/CLR 3.94"LX2.68"

0

PRT-11984

PRT-11984

SparkFun

BOX PLASTIC CLEAR 4.25"L X 2.4"W

0

JBM-010

JBM-010

Pi Supply

JUSTBOOM DIGI HAT CASE - BLACK

0

1593HAMEGG2TPU

1593HAMEGG2TPU

Hammond Manufacturing

BOX ABS TRN PURPLE 5.71"LX3.94"W

0

PIS-0411

PIS-0411

Pi Supply

PAPIRUS HAT CASE

0

2251

2251

Adafruit

BOX PLSTC GREEN 3.62" LX2.48" W

0

1593HAMPI2TBU

1593HAMPI2TBU

Hammond Manufacturing

BOX ABS TRN BLUE 3.88"L X 2.74"W

0

110990059

110990059

Seeed

CASE PLASTIC CLEAR

0

PIM164

PIM164

Pimoroni

CASE PLASTIC TRANSLUCENT BLUE

0

2628

2628

Adafruit

BEAGLEBONE CASE SILVER ALUMINUM

0

PIM120

PIM120

Pimoroni

CASE PLASTIC RED

0

114110003

114110003

Seeed

CASE PLASTIC

0

PIM124

PIM124

Pimoroni

CASE PLASTIC GREEN

0

2627

2627

Adafruit

BEAGLEBONE CASE BLACK ALUMINUM

0

114110002

114110002

Seeed

CASE PLASTIC

0

PIM056

PIM056

Pimoroni

CASE PLASTIC CLEAR/PURPLE

0

PIS-1592

PIS-1592

Pi Supply

RAKBOX-GW OUTDOOR ENCLOSURE

0

PIM123

PIM123

Pimoroni

CASE PLASTIC TRANSLUCENT BLUE

0

Evaluation, Development Board Enclosures

1. Overview

Development board enclosures are protective housings designed to safeguard electronic development boards while enabling functional access. These enclosures provide mechanical protection, electromagnetic interference (EMI) shielding, thermal management, and environmental resistance. They play a critical role in prototyping, industrial automation, IoT deployments, and educational platforms by ensuring reliable operation under various conditions.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Plastic EnclosuresLightweight, cost-effective, insulating propertiesEducational kits, hobbyist projects
Metal EnclosuresSuperior EMI shielding, thermal dissipationIndustrial control systems
Modular EnclosuresCustomizable compartments, tool-less assemblyRapid prototyping environments
IP-Rated EnclosuresWater/dust resistance (IP65-IP67)Outdoor IoT sensors

3. Structure and Components

Typical enclosures consist of: - Base chassis: Provides structural integrity and mounting points - Removable panels: Allow access to interfaces and expansion slots - Heat dissipation features: Ventilation grids or embedded heat sinks - EMI shielding: Conductive gaskets or metalized coatings - Cable management: Strain relief ports and routing channels

4. Key Technical Specifications

ParameterImportance
Material Type (ABS/Aluminum/Steel)Determines weight, durability, and shielding
Dimensional Range (50-500mm)Affects board compatibility
IP Rating (IP54-IP68)Defines environmental protection level
Thermal ResistanceImpacts sustained performance in enclosed spaces
Vibration ResistanceCritical for industrial/automotive applications

5. Application Fields

  • IoT Infrastructure: Smart city sensors (e.g., Raspberry Pi housed in IP67 enclosures)
  • Industrial Automation: PLC control panels with EMI-shielded aluminum cases
  • Medical Devices: Diagnostic equipment development platforms
  • Education: STEM kits with transparent plastic enclosures

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Raspberry Pi FoundationOfficial Raspberry Pi 4 Enclosure with active cooling
Arduino SAArduino Uno Transparent Plastic Case
EbenIndustrial Metal Enclosure for Jetson Nano
RS ProModular DIN Rail Mount Enclosure

7. Selection Guidelines

Key considerations include: - Board form factor compatibility (e.g., HAT/Shield alignment) - Operating environment (temperature, humidity, vibration) - Required certifications (CE, RoHS) - Expandability for future hardware upgrades - Cost vs. performance trade-offs

8. Industry Trends Analysis

Emerging trends include: - Integration of thermal interface materials (TIMs) in plastic enclosures - Adoption of additive manufacturing for customized geometries - Increased demand for 5G-compatible EMI shielding solutions - Growth of edge computing driving ruggedized enclosure requirements - Sustainability focus driving bio-based polymer enclosures

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