Card Rack Accessories

Image Part Number Description / PDF Quantity Rfq
34561084

34561084

Schroff / nVent

REAR MID HORIZ RL 84HP INDIRECT

0

10849001

10849001

Schroff / nVent

ATCA AMC CARRIER KIT MTCA MODULE

137

34560484

34560484

Schroff / nVent

REAR HORIZ RL 84HP LT INDRCT MNT

221

34560487

34560487

Schroff / nVent

6U 235MM SIDE PLATE

0

24564197

24564197

Schroff / nVent

3U 19" BRCKTS W/O HDLE HLES 1SET

20

60897278

60897278

Schroff / nVent

PMC MEZZANINE BOARD SPACER

1811

69004131

69004131

Schroff / nVent

TEST SOCKET 2MM DOUBLE SHORT

0

60835022

60835022

Schroff / nVent

PMC MEZZANINE COVER

736

34561184

34561184

Schroff / nVent

REAR MID HORIZ RL 84HP DIRECT

49

21101705

21101705

Schroff / nVent

3U EMC SS GASKET 10 PCS

0

Card Rack Accessories

1. Overview

Card Rack Accessories are specialized components designed to support, organize, and protect modular electronic cards and systems within enclosures and racks. These accessories optimize space utilization, ensure mechanical stability, and facilitate thermal management in complex equipment setups. Their importance has grown with the proliferation of high-density computing, telecommunications infrastructure, and industrial control systems requiring scalable and maintainable hardware architectures.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Slide RailsTelescopic guides with ball bearings for smooth card insertion/removalTelecom switches, server blades
Mounting BracketsAdjustable angle supports for non-standard card orientationsIndustrial process controllers
Blanking PanelsSheet metal covers preventing airflow bypassData center switch racks
Cable Management ArmsArticulated guides for organized cable routingHigh-speed data routers
Label HoldersRotating or sliding identification panelsNetwork distribution frames

3. Structure & Composition

Typical assemblies consist of cold-rolled steel or aluminum alloy frameworks with zinc-plated surfaces for corrosion resistance. Modular designs feature precision-machined slots (2.0-3.5mm tolerance) and quick-release mechanisms. Advanced models integrate EMI shielding gaskets, thermal interface materials, and captive screws. Load-bearing structures employ reinforced cross-member geometries with yield strength 350MPa materials.

4. Key Technical Parameters

ParameterTypical RangeImportance
Load Capacity5-50kg per rail setEnsures structural integrity under operational loads
Dimensional Tolerance 0.1mm to 0.5mmGuarantees proper card alignment and mating
Thermal Conductivity150-250 W/m KEnables efficient heat dissipation
Vibration Resistance10-50G shock ratingMaintains reliability in harsh environments
EMI Shielding Effectiveness30-100dB attenuationProtects signal integrity in high-frequency systems

5. Application Fields

  • Telecommunications: 5G base stations, optical transport networks
  • Data Centers: Blade servers, storage arrays
  • Industrial Automation: PLC racks, process controllers
  • Test & Measurement: Modular instrument chassis
  • Aerospace: Avionics line-replaceable units (LRUs)

6. Leading Manufacturers & Products

ManufacturerKey ProductsTechnical Highlights
EatonSmartRail SystemsIntegrated power monitoring capabilities
PanduitU6 Universal RackToolless mounting system with 42U capacity
RittalTS 8 Modular EnclosuresIP55 protection rating with active cooling
Hammond Manufacturing1551XX SeriesPolycarbonate viewing windows with LED lighting

7. Selection Recommendations

Key considerations include load requirements (calculate safety factor 2), compatibility with card form factors (e.g., 3U/6U VMEbus), thermal management needs ( T 5 C rise), and future expansion potential. In a recent data center upgrade project, engineers selected low-profile slide rails with 8mm deflection tolerance to accommodate 25G optical modules while maintaining backward compatibility with existing 10G systems.

8. Industry Trends

Current developments focus on: a) Additive manufacturing for customized geometries, b) Embedded sensors for real-time vibration monitoring, c) High-density designs supporting 40+ cards per rack unit, d) Nano-coatings for corrosion resistance in marine environments. The market shows 6.8% CAGR driven by 5G infrastructure deployments and edge computing requirements.

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