| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Schroff / nVent |
ADVTCA ATCA PLNG IEA DIE CST HDL |
1 |
|
 |
Schroff / nVent |
VME64X CPCI FRNT HORIZ RAIL 63HP |
41 |
|
 |
Schroff / nVent |
3U 19" BRACKET WITH HANDLE HOLES |
0 |
|
 |
Schroff / nVent |
ADVANCEDTCA ATCA FILLER PANEL |
7 |
|
 |
Schroff / nVent |
6U EMC SS GASKET 10 PCS |
60 |
|
 |
Schroff / nVent |
6U AC INPUT MODULE 10 PCS |
22 |
|
 |
Schroff / nVent |
PNL 3U 8HP (ANODZD UNTRTD EDG) |
60 |
|
 |
Schroff / nVent |
VME FRONT HORIZ RAIL 84HP HEAVY |
77 |
|
 |
Schroff / nVent |
THREADED INSERT M2.5 63HP |
92 |
|
 |
Schroff / nVent |
PNL 6U 4HP (ANODZD UNTRTD EDG) |
285 |
|
 |
Schroff / nVent |
VME64X CPCI FRNT HORIZ RAIL 1M |
21 |
|
 |
Schroff / nVent |
PCB METAL BRACKET |
5512 |
|
 |
Schroff / nVent |
3U AC INPUT MODULE 10 PCS |
59 |
|
 |
Schroff / nVent |
PNL 3U 8HP (ANODIZED-CHROMATED) |
0 |
|
 |
Schroff / nVent |
RR HORIZ RL 84HP HVY INDRCT MNT |
377 |
|
 |
Schroff / nVent |
1/4 TURN FASTENER (BLACK) 100 PC |
0 |
|
 |
Schroff / nVent |
MICROSWITCH W/HARNESS/CONECTR |
0 |
|
 |
Schroff / nVent |
6U REAR ANGLES 1 SET |
11 |
|
 |
Schroff / nVent |
THREADED INSERT M2.5 84HP |
1687 |
|
 |
Schroff / nVent |
6U AC INPUT MODULE 100 PCS |
12 |
|
Card Rack Accessories are specialized components designed to support, organize, and protect modular electronic cards and systems within enclosures and racks. These accessories optimize space utilization, ensure mechanical stability, and facilitate thermal management in complex equipment setups. Their importance has grown with the proliferation of high-density computing, telecommunications infrastructure, and industrial control systems requiring scalable and maintainable hardware architectures.
| Type | Functional Features | Application Examples |
|---|---|---|
| Slide Rails | Telescopic guides with ball bearings for smooth card insertion/removal | Telecom switches, server blades |
| Mounting Brackets | Adjustable angle supports for non-standard card orientations | Industrial process controllers |
| Blanking Panels | Sheet metal covers preventing airflow bypass | Data center switch racks |
| Cable Management Arms | Articulated guides for organized cable routing | High-speed data routers |
| Label Holders | Rotating or sliding identification panels | Network distribution frames |
Typical assemblies consist of cold-rolled steel or aluminum alloy frameworks with zinc-plated surfaces for corrosion resistance. Modular designs feature precision-machined slots (2.0-3.5mm tolerance) and quick-release mechanisms. Advanced models integrate EMI shielding gaskets, thermal interface materials, and captive screws. Load-bearing structures employ reinforced cross-member geometries with yield strength 350MPa materials.
| Parameter | Typical Range | Importance |
|---|---|---|
| Load Capacity | 5-50kg per rail set | Ensures structural integrity under operational loads |
| Dimensional Tolerance | 0.1mm to 0.5mm | Guarantees proper card alignment and mating |
| Thermal Conductivity | 150-250 W/m K | Enables efficient heat dissipation |
| Vibration Resistance | 10-50G shock rating | Maintains reliability in harsh environments |
| EMI Shielding Effectiveness | 30-100dB attenuation | Protects signal integrity in high-frequency systems |
| Manufacturer | Key Products | Technical Highlights |
|---|---|---|
| Eaton | SmartRail Systems | Integrated power monitoring capabilities |
| Panduit | U6 Universal Rack | Toolless mounting system with 42U capacity |
| Rittal | TS 8 Modular Enclosures | IP55 protection rating with active cooling |
| Hammond Manufacturing | 1551XX Series | Polycarbonate viewing windows with LED lighting |
Key considerations include load requirements (calculate safety factor 2), compatibility with card form factors (e.g., 3U/6U VMEbus), thermal management needs ( T 5 C rise), and future expansion potential. In a recent data center upgrade project, engineers selected low-profile slide rails with 8mm deflection tolerance to accommodate 25G optical modules while maintaining backward compatibility with existing 10G systems.
Current developments focus on: a) Additive manufacturing for customized geometries, b) Embedded sensors for real-time vibration monitoring, c) High-density designs supporting 40+ cards per rack unit, d) Nano-coatings for corrosion resistance in marine environments. The market shows 6.8% CAGR driven by 5G infrastructure deployments and edge computing requirements.