| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
PulseLarsen Antenna |
TRANSFORMER AUDIO 1:1 SMD |
7722 |
|
 |
PulseLarsen Antenna |
TRANSFORMER AUDIO 1500VRMS SMD |
0 |
|
|
PulseLarsen Antenna |
XFRMR 1:1 FOR CIRRUS LOGIC T/H |
480 |
|
|
PulseLarsen Antenna |
TRANSFORMER AUDIO 1500VRMS SMD |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
TRANSFORMER AUDIO SMD |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
COMMON MODE CHOKE |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
COMMON MODE CHOKE |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
|
PulseLarsen Antenna |
IC CHIP |
0 |
|
Audio Transformers are electromagnetic devices that transfer electrical energy between two or more circuits through electromagnetic induction. They play a critical role in audio systems by enabling impedance matching, signal isolation, voltage/current conversion, and noise suppression. These components are essential in maintaining signal integrity and optimizing performance across audio frequency ranges (typically 20Hz-20kHz). Their importance spans professional audio equipment, consumer electronics, and industrial systems.
| Type | Functional Features | Application Examples |
|---|---|---|
| Input Transformers | High impedance matching, balanced-to-unbalanced conversion | Mixer consoles, microphone preamps |
| Output Transformers | Voltage step-down, load impedance adaptation | Power amplifiers, speaker systems |
| Isolation Transformers | Galvanic separation, ground loop elimination | DI boxes, audio interfaces |
| Phase Splitter Transformers | Signal phase inversion with equal amplitude | Push-pull amplifier circuits |
Typical audio transformers consist of: - **Core Materials**: Laminated silicon steel (for low-frequency response) or ferrite (for high-frequency applications) - **Windings**: Primary and secondary coils with precise turn ratios, often using enamel-coated copper wire - **Insulation**: Dielectric barriers between windings for safety isolation - **Enclosure**: Metal or plastic housing for electromagnetic shielding and mechanical protection
| Parameter | Description | Importance |
|---|---|---|
| Frequency Response | Range: 10Hz-100kHz (typical audio bandwidth) | Ensures full-spectrum audio reproduction |
| Turns Ratio | Voltage ratio: 1:1 to 1:20 (varies by application) | Determines impedance matching capability |
| Impedance | Primary/secondary values: 50 -10k | Matches source/load impedances for maximum power transfer |
| Power Handling | 1W-1kW rating depending on size | Prevents saturation in high-power applications |
| THD (Total Harmonic Distortion) | Typical <0.1% at 1kHz | Maintains signal fidelity |
Major industries include: - **Professional Audio**: Concert sound systems, studio recording equipment - **Consumer Electronics**: Home theater systems, headphone amplifiers - **Broadcast**: Transmitters, mixing consoles - **Industrial**: Public address systems, test and measurement devices - **Musical Instruments**: Guitar amplifiers, DI boxes
| Manufacturer | Key Products | Specifications |
|---|---|---|
| Cinemag | Vintage-Style Output Transformers | 300Hz-20kHz response, 500V isolation |
| Triad Magnetics | SP-6388 Input Transformer | 600 :600 ratio, 2W power rating |
| Stancor | P-1118 Isolation Transformer | 1:1 ratio, 1500V dielectric withstand |
Key considerations: - Match impedance ratios to source/load requirements - Verify frequency response aligns with application bandwidth - Calculate power handling needs with 20% safety margin - Prioritize low THD (<0.05%) for critical audio paths - Consider physical size constraints and cooling requirements - Example: Selecting a 1:10 step-up transformer for moving-coil phono cartridges requires 20Hz-50kHz frequency response and 5mW power handling.
Current developments include: - Miniaturization through advanced core materials (nanocrystalline alloys) - Integration with digital signal processing (hybrid analog-digital designs) - Improved efficiency via planar transformer technology - Increased adoption of surface-mount (SMD) packages for automated manufacturing - Enhanced EMC performance for wireless audio systems