Dispensing Equipment - Applicators, Dispensers

Image Part Number Description / PDF Quantity Rfq
HMS-G4C2

HMS-G4C2

3M

HANDYMAX DISPENSER

0

JGD82029-L

JGD82029-L

Jensen Global Inc.

LITHIUM IONGUN FOR 29OZ CARTRIDG

0

36863

36863

3M

DIRT TRAP CLEAR FILM DISPENSER

0

POLYGUN-II-BENCHSTAND

POLYGUN-II-BENCHSTAND

3M

HOT MELT APPL PG II HD BENCH

0

90-08-7901-0000

90-08-7901-0000

Parker Chomerics

NORDSON EFD P/N 7704342 1 KDSP S

0

TPA150M

TPA150M

3M

MAINTENANCE ADHESIVE KIT W/GUN

0

6788

6788

3M

M3000K-ML DISPENSER KIT

0

JGD82010-L

JGD82010-L

Jensen Global Inc.

LITHIUM IONGUN FOR 10.3OZ CARTRI

0

04992

04992

3M

DURAMIX DISPENSER 50CC

0

9938-MAGAZINE

9938-MAGAZINE

3M

SCOTCH-WELD APPL PG II W MAG

0

JGD82600-BL

JGD82600-BL

Jensen Global Inc.

LITHIUM IONGUN FOR 20OZ BULK DIS

0

6985-1

6985-1

3M

PNEUMATIC DISPENSER 12OZ CARTRID

0

Dispensing Equipment - Applicators, Dispensers

1. Overview

Dispensing equipment refers to precision devices that meter and apply liquid, paste, or semi-liquid materials in controlled amounts. These systems are critical in modern manufacturing for ensuring product quality, process efficiency, and material conservation. They are widely used in electronics, automotive, medical, and construction industries for applications ranging from adhesive bonding to precise chemical dosing.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Manual DispensersHand-operated, low-cost, variable precisionPrototyping, small-batch production
Automatic DispensersProgrammable, high repeatability, integration with production linesMass production of electronics
Time-Pressure SystemsControlled by time and air pressure parametersUnderfill in semiconductor packaging
Auger ValvesHigh-precision screw-driven material deliveryMedical device adhesive application
Jetting DispensersNon-contact, high-speed material ejectionLED encapsulation

3. Structure and Components

Typical dispensing systems consist of: - Material reservoir with temperature control - Precision dispensing valve (pneumatic/hydraulic/electric) - XYZ motion control system (gantry or robotic arm) - Process monitoring sensors - HMI (Human-Machine Interface) for parameter setting - Curing modules (UV/thermal) for reactive materials

4. Key Technical Specifications

ParameterImportance
Dispensing Accuracy ( %)Directly affects product quality and yield
Flow Rate Range (ml/min)Determines process throughput capability
Material CompatibilityChemical resistance and viscosity range
Control Resolution ( m)Defines minimum feature application capability
Operating Pressure (bar)Impacts material delivery consistency

5. Application Fields

Key industries include: - Electronics: Chip encapsulation, SMT adhesive application - Automotive: Gasket sealing, structural bonding - Medical: Diagnostic test strip coating, syringe filling - Consumer Goods: Cosmetics formulation, food-grade dispensing - Aerospace: Composite material layup, sealant application

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Nordson CorporationAsymtek DX-106High-precision fluid dispensing platform
Cambridge Polymer GroupCPG-2000Multi-material thermal management system
Fisnar Inc.F4000 SeriesModular dispensing workstations
Mydata AutomationDispenseMotionHigh-speed jetting solution

7. Selection Guide

Key considerations: - Material properties (viscosity, curing type, abrasiveness) - Production volume requirements - Required pattern complexity and spatial resolution - Cleanroom compatibility - Maintenance accessibility - Integration with existing automation

8. Industry Trends

Emerging trends include: - Increased adoption of AI-driven process optimization - Development of micro-dispensing systems for advanced packaging - Growth in demand for 3D dispensing capabilities - Integration with Industry 4.0 IoT-enabled monitoring - Sustainable material handling solutions

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