Test Probe Tips

Image	Part Number	Description / PDF	Quantity	Rfq
	0629000967 Woodhead - Molex	TEST PROBE	0
	0636000097 Woodhead - Molex	TEST PROBE PIN 636000097	0
	0628010000 Woodhead - Molex	TESTPROBE ASSY RAST 5	0
	0625001847 Woodhead - Molex	TEST PROBE	0
	0636000475 Woodhead - Molex	TEST PROBE	0

Test Probe Tips

1. Overview

Test Probe Tips are critical components in electronic measurement systems, serving as the physical interface between testing instruments (e.g., oscilloscopes, multimeters) and devices under test (DUTs). They condition signals by maintaining signal integrity, minimizing noise, and ensuring accurate data acquisition. Their importance spans industries such as semiconductor development, telecommunications, and automotive electronics, where precise measurements are essential for design validation and quality assurance.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Passive Voltage Probes	High impedance (10M ), no external power required, 1:1 or 10:1 attenuation	General-purpose circuit debugging, power supply testing
Active Voltage Probes	Powered design, 50 termination, bandwidth >1GHz, low capacitive loading	High-speed digital circuits (e.g., DDR5 memory testing)
Differential Probes	Measures voltage between two points, CMRR >100dB at 1MHz	Switching power supply analysis, CAN bus signal testing
Current Probes	Non-invasive measurement via Hall effect or Rogowski coil, AC/DC capability	Motor drive current analysis, battery consumption testing
High-Voltage Probes	8kV-40kV rating, Class 1 safety compliance, 100:1 attenuation ratio	Power grid equipment testing, X-ray machine diagnostics

3. Structure and Components

A standard probe tip assembly consists of:

Probe Head: Precision-machined conductive tip (tungsten or phosphor bronze) with insulation sleeve
Connection Interface: BNC/SMA/SMC connectors or proprietary interfaces (e.g., TekVPI)
Transmission Path: Coaxial cable with controlled impedance (50 or 100 ) and EMI shielding
Compensation Circuits: Adjustable RC networks for frequency response optimization
Mechanical Strain Relief: Polymer overmolding to prevent cable fatigue failures

4. Key Technical Specifications

Parameter	Description	Importance
Bandwidth	Frequency range maintaining 2dB amplitude accuracy (e.g., 500MHz-8GHz)	Determines measurable signal speed and edge definition
Attenuation Ratio	Signal scaling factor (e.g., 10:1 reduces scope input by 10x)	Protects instruments from overvoltage while maintaining measurement range
Input Capacitance	Parasitic capacitance at probe tip (<1pF for active probes)	Lower values reduce circuit loading effects in high-speed applications
Rise Time	Fastest measurable edge transition (e.g., 35ps for 10Gbps signals)	Critical for timing analysis in digital systems
Withstand Voltage	Max non-destructive voltage rating (e.g., 40kV CAT III)	Safety compliance for industrial and power electronics testing

5. Application Fields

Key industries include:

Consumer Electronics: Mobile chip validation using 10GHz active probes
Automotive: CAN FD bus testing with isolated differential probes
Renewable Energy: IGBT switching analysis in solar inverters via high-voltage tips
Medical Devices: ECG signal acquisition with ultra-low noise passive probes
Aerospace: Avionics signal integrity testing at 67GHz millimeter-wave frequencies

6. Leading Manufacturers and Products

Manufacturer	Flagship Product	Key Specifications
Keysight Technologies	N2872A High-Z Passive Probe	500MHz bandwidth, 4kV rating, 10:1 attenuation
Teledyne LeCroy	PP018 High-Speed Active Probe	8GHz bandwidth, 0.5pF input capacitance
Fluke	i430-Flex Current Probe	150A/5500A range, 1Hz-100kHz frequency response
Rohde & Schwarz	RTH-HV High-Voltage Probe	6kV differential measurement capability

7. Selection Recommendations

Key selection criteria:

Match probe bandwidth to 3-5 signal frequency for accurate rise time measurement
Select attenuation ratio based on DUT voltage levels and instrument input range
For differential signals, ensure CMRR > 60dB at target frequencies
Consider probe loading effects: Z_probe 10 Z_circuit
Environmental factors: Temperature range (-40 C to +150 C), vibration resistance

8. Industry Trends

Emerging trends include:

Integration of MEMS-based capacitive sensors for sub-picosecond timing resolution
Development of 112Gbps-compatible active probes with on-tip signal conditioning
Adoption of optical interconnects to eliminate ground loops in RF measurements
Growing demand for multi-function probes combining voltage/current/temperature sensing
AI-driven probe health monitoring systems for predictive maintenance in production lines