Test Probe Tips

Image Part Number Description / PDF Quantity Rfq
972356101

972356101

Altech Corporation

TEST SOCKET SEB 2620 RED 4MM TES

20

CT3941B

CT3941B

Cal Test Electronics

EXT TIP ADAPTER 3900B UL 50MM BR

25

930147000

930147000

Altech Corporation

TEST SOCKET BU 10 4MM TEST SOCKE

40

5682-0

5682-0

Pomona Electronics

ADAPTER EXTENDED TIP BLACK

25

972356105

972356105

Altech Corporation

TEST SOCKET SEB 2620 BROWN 4MM T

80

930320102

930320102

Altech Corporation

TEST SOCKET MKU 1 BLUE 2MM SOCKE

0

972362102

972362102

Altech Corporation

TEST SOCKET SEP 2620 BLUE 4MM TE

0

931714104

931714104

Altech Corporation

TEST SOCKETPKI 10 GRN 4MM TEST S

0

930320100

930320100

Altech Corporation

TEST SOCKET MKU 1 BLK 2MM SOCKET

160

973995101

973995101

Altech Corporation

TESTPROBEPRUEF MPS2 RED SPRING L

15

124001R

124001R

TPI (Test Products International)

SPADE TERMINAL RED

0

930176701

930176701

Altech Corporation

TEST SOCKET BIL 20 AU RED 4MM TE

180

930099102

930099102

Altech Corporation

TEST SOCKET PK 10A BLUE 4MM M4 T

0

972359101

972359101

Altech Corporation

TEST SOCKET SEB 2630 RED 4MM TES

40

CT3211-6

CT3211-6

Cal Test Electronics

FUSED MODULAR PROBE 0.5A/1000V B

0

66000-7

66000-7

TE Connectivity AMP Connectors

TEST PROBE RCPT TPBR

0

972363103

972363103

Altech Corporation

TEST SOCKET SEP 2630 YEL 4MM TES

0

930175101

930175101

Altech Corporation

TEST SOCKET BUG 10 RED 4MM TEST

20

975017700

975017700

Altech Corporation

TESTPROBEPRUEF 1600 AU BLK SPRIN

20

930166105

930166105

Altech Corporation

TEST SOCKET BIL 30 BROWN 4MM TES

0

Test Probe Tips

1. Overview

Test Probe Tips are critical components in electronic measurement systems, serving as the physical interface between testing instruments (e.g., oscilloscopes, multimeters) and devices under test (DUTs). They condition signals by maintaining signal integrity, minimizing noise, and ensuring accurate data acquisition. Their importance spans industries such as semiconductor development, telecommunications, and automotive electronics, where precise measurements are essential for design validation and quality assurance.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Passive Voltage ProbesHigh impedance (10M ), no external power required, 1:1 or 10:1 attenuationGeneral-purpose circuit debugging, power supply testing
Active Voltage ProbesPowered design, 50 termination, bandwidth >1GHz, low capacitive loadingHigh-speed digital circuits (e.g., DDR5 memory testing)
Differential ProbesMeasures voltage between two points, CMRR >100dB at 1MHzSwitching power supply analysis, CAN bus signal testing
Current ProbesNon-invasive measurement via Hall effect or Rogowski coil, AC/DC capabilityMotor drive current analysis, battery consumption testing
High-Voltage Probes8kV-40kV rating, Class 1 safety compliance, 100:1 attenuation ratioPower grid equipment testing, X-ray machine diagnostics

3. Structure and Components

A standard probe tip assembly consists of:

  • Probe Head: Precision-machined conductive tip (tungsten or phosphor bronze) with insulation sleeve
  • Connection Interface: BNC/SMA/SMC connectors or proprietary interfaces (e.g., TekVPI)
  • Transmission Path: Coaxial cable with controlled impedance (50 or 100 ) and EMI shielding
  • Compensation Circuits: Adjustable RC networks for frequency response optimization
  • Mechanical Strain Relief: Polymer overmolding to prevent cable fatigue failures

4. Key Technical Specifications

ParameterDescriptionImportance
BandwidthFrequency range maintaining 2dB amplitude accuracy (e.g., 500MHz-8GHz)Determines measurable signal speed and edge definition
Attenuation RatioSignal scaling factor (e.g., 10:1 reduces scope input by 10x)Protects instruments from overvoltage while maintaining measurement range
Input CapacitanceParasitic capacitance at probe tip (<1pF for active probes)Lower values reduce circuit loading effects in high-speed applications
Rise TimeFastest measurable edge transition (e.g., 35ps for 10Gbps signals)Critical for timing analysis in digital systems
Withstand VoltageMax non-destructive voltage rating (e.g., 40kV CAT III)Safety compliance for industrial and power electronics testing

5. Application Fields

Key industries include:

  • Consumer Electronics: Mobile chip validation using 10GHz active probes
  • Automotive: CAN FD bus testing with isolated differential probes
  • Renewable Energy: IGBT switching analysis in solar inverters via high-voltage tips
  • Medical Devices: ECG signal acquisition with ultra-low noise passive probes
  • Aerospace: Avionics signal integrity testing at 67GHz millimeter-wave frequencies

6. Leading Manufacturers and Products

ManufacturerFlagship ProductKey Specifications
Keysight TechnologiesN2872A High-Z Passive Probe500MHz bandwidth, 4kV rating, 10:1 attenuation
Teledyne LeCroyPP018 High-Speed Active Probe8GHz bandwidth, 0.5pF input capacitance
Flukei430-Flex Current Probe150A/5500A range, 1Hz-100kHz frequency response
Rohde & SchwarzRTH-HV High-Voltage Probe6kV differential measurement capability

7. Selection Recommendations

Key selection criteria:

  • Match probe bandwidth to 3-5 signal frequency for accurate rise time measurement
  • Select attenuation ratio based on DUT voltage levels and instrument input range
  • For differential signals, ensure CMRR > 60dB at target frequencies
  • Consider probe loading effects: Zprobe 10 Zcircuit
  • Environmental factors: Temperature range (-40 C to +150 C), vibration resistance

8. Industry Trends

Emerging trends include:

  • Integration of MEMS-based capacitive sensors for sub-picosecond timing resolution
  • Development of 112Gbps-compatible active probes with on-tip signal conditioning
  • Adoption of optical interconnects to eliminate ground loops in RF measurements
  • Growing demand for multi-function probes combining voltage/current/temperature sensing
  • AI-driven probe health monitoring systems for predictive maintenance in production lines

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