Test Points

Part Number	Description / PDF	Quantity
5020 Keystone Electronics Corp.	PC TEST POINT LOW PROFILE	2147483647
11012-B Keystone Electronics Corp.	PC TEST POINT JACK BLACK	523
81-1-S E-Z-Hook	STANDARD HOOK MULTIPLE 10/BAG	0
11001-R Keystone Electronics Corp.	PC TEST POINT JACK RED	67161
6056 Keystone Electronics Corp.	PC TEST POINT JACK BLACK	1736600
129-0701-201 Vitelec / Cinch Connectivity Solutions	PC TEST POINT JACK	817
81-1-S BRN E-Z-Hook	STANDARD HOOK BROWN 10PK	0
81-1-S WTE E-Z-Hook	STANDARD HOOK WHITE 10PK	0
105-0853-001 Vitelec / Cinch Connectivity Solutions	PC TEST POINT JACK BLACK	7143
5024 Keystone Electronics Corp.	PC TEST POINT LARGE PROFILE	39064500
11007-R Keystone Electronics Corp.	PC TEST POINT JACK RED	456
5124 Keystone Electronics Corp.	PC TEST POINT COMPACT PURPLE	7179600
1035 Keystone Electronics Corp.	PC TEST POINT SLOTTED	2147483647
105-0851-001 Vitelec / Cinch Connectivity Solutions	PC TEST POINT JACK WHITE	1362
5289 Keystone Electronics Corp.	TEST POINT (PURPLE) - MULTIPURPO	4865400
81-1-S GRY E-Z-Hook	STANDARD HOOK GRAY 10PK	0
86-1-S-BLU E-Z-Hook	STANDARD HOOK BLUE 10PK	0
5013 Keystone Electronics Corp.	PC TEST POINT MULTI PURP ORANGE	2147483647
11010-R Keystone Electronics Corp.	PC TEST POINT JACK RED	369
5195TR Keystone Electronics Corp.	PC TEST POINT, BROWN, SMT	45028000

Test Points

1. Overview

Test points are standardized locations on electronic devices or systems designated for signal access, measurement, and diagnostic purposes. They serve as critical interfaces for validating performance, troubleshooting faults, and ensuring compliance with technical specifications. In modern electronics, test points enable efficient development, quality assurance, and maintenance across industries.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
PCB Test Points	Direct contact pads on printed circuit boards	Prototype validation, production line testing
High-Voltage Probes	Insulated contacts for >1kV measurements	Power supply testing, industrial equipment diagnostics
RF Test Points	Impedance-matched interfaces for high-frequency signals	Wireless communication modules, antenna testing
Automotive Diagnostic Ports	Standardized OBD-II connectors	Vehicle ECU diagnostics, emission testing

3. Structure and Composition

Typical test points consist of: - Conductive contact materials (e.g., gold-plated copper, phosphor bronze) - Insulating housing with environmental protection (IP67-rated plastics) - Mechanical mounting features (through-hole/surface-mount) - Interface standards (BNC, SMA, USB-C, or proprietary connectors) - Optional protective covers with EMI shielding

4. Key Technical Specifications

Parameter	Significance
Max Current Rating	Determines power handling capability
Voltage Range	Defines operational safety limits
Frequency Bandwidth	Specifies usable range for signal integrity
Contact Resistance	Impacts measurement accuracy (typically <10m )
Environmental Resistance	Operating temperature (-40 C to +125 C), humidity tolerance

5. Application Fields

Electronics Manufacturing: Circuit validation using oscilloscopes
Automotive: ECU communication via OBD-II ports
Medical Devices: Patient safety testing (IEC 60601 compliance)
Telecommunications: 5G base station signal monitoring
Aerospace: Avionics system diagnostics

6. Leading Manufacturers and Products

Manufacturer	Representative Product
Keysight Technologies	N2855A High-Z RF Probe
Tektronix	P6139B 500MHz Oscilloscope Probe
Fluke Corporation	TPIL1 Test Point Interface Lead Set
Amphenol	RF Test Port 6001-0001-0

7. Selection Guidelines

Key considerations include: - Match impedance and bandwidth to measurement equipment - Verify compliance with industry standards (e.g., IEEE, ISO 14001) - Environmental durability for operating conditions - Compatibility with automated test systems - Cost-benefit analysis of reusable vs. disposable probes

Example: Automotive manufacturers select test points with ISO 7637-2 compliance for reliable ECU testing in extreme temperature cycles.

8. Industry Trends

Emerging trends include: - Miniaturization for high-density PCBs (0.4mm pitch test points) - Integration with wireless test interfaces (Bluetooth/WiFi 6E) - Increased adoption of active probes for >10Gbps signal analysis - Smart test points with embedded sensors for real-time monitoring - Eco-friendly materials meeting RoHS/REACH regulations