Test Points

Image Part Number Description / PDF Quantity Rfq
8607-4ORN

8607-4ORN

E-Z-Hook

STANDARD HOOK ORANGE

0

6047

6047

Keystone Electronics Corp.

PC TEST POINT JACK BLUE

400

BQR-J-20

BQR-J-20

Samtec, Inc.

BULLSEYE HEADER

0

6040

6040

Keystone Electronics Corp.

PC TEST POINT JACK GREEN

613300

8607-8ORN

8607-8ORN

E-Z-Hook

STANDARD HOOK ORANGE

0

8607-6ORN

8607-6ORN

E-Z-Hook

STANDARD HOOK ORANGE

0

6063

6063

Keystone Electronics Corp.

PC TEST POINT JACK YELLOW

200

1437355-3

1437355-3

TE Connectivity Aerospace Defense and Marine

OEC TEP3640N TEST SOCKET ASSEMBL

0

6051

6051

Keystone Electronics Corp.

PC TEST POINT JACK YELLOW

200

CCH-J-02

CCH-J-02

Samtec, Inc.

PC TEST POINT BLACK

0

6070

6070

Keystone Electronics Corp.

PC TEST POINT JACK GREEN

200

8607-10BRN

8607-10BRN

E-Z-Hook

STANDARD HOOK BROWN

0

6046

6046

Keystone Electronics Corp.

PC TEST POINT JACK GREEN

300

6059

6059

Keystone Electronics Corp.

PC TEST POINT JACK BLUE

700

395-13-101-03-380000

395-13-101-03-380000

Mill-Max

PC TEST POINT R/A BLACK

0

6068

6068

Keystone Electronics Corp.

PC TEST POINT JACK BLACK

500

6058

6058

Keystone Electronics Corp.

PC TEST POINT JACK GREEN

0

6069

6069

Keystone Electronics Corp.

PC TEST POINT JACK YELLOW

951500

8607-8BLK

8607-8BLK

E-Z-Hook

STANDARD HOOK BLACK

0

8607-8YEL

8607-8YEL

E-Z-Hook

STANDARD HOOK YELLOW

0

Test Points

1. Overview

Test points are standardized locations on electronic devices or systems designated for signal access, measurement, and diagnostic purposes. They serve as critical interfaces for validating performance, troubleshooting faults, and ensuring compliance with technical specifications. In modern electronics, test points enable efficient development, quality assurance, and maintenance across industries.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
PCB Test PointsDirect contact pads on printed circuit boardsPrototype validation, production line testing
High-Voltage ProbesInsulated contacts for >1kV measurementsPower supply testing, industrial equipment diagnostics
RF Test PointsImpedance-matched interfaces for high-frequency signalsWireless communication modules, antenna testing
Automotive Diagnostic PortsStandardized OBD-II connectorsVehicle ECU diagnostics, emission testing

3. Structure and Composition

Typical test points consist of: - Conductive contact materials (e.g., gold-plated copper, phosphor bronze) - Insulating housing with environmental protection (IP67-rated plastics) - Mechanical mounting features (through-hole/surface-mount) - Interface standards (BNC, SMA, USB-C, or proprietary connectors) - Optional protective covers with EMI shielding

4. Key Technical Specifications

ParameterSignificance
Max Current RatingDetermines power handling capability
Voltage RangeDefines operational safety limits
Frequency BandwidthSpecifies usable range for signal integrity
Contact ResistanceImpacts measurement accuracy (typically <10m )
Environmental ResistanceOperating temperature (-40 C to +125 C), humidity tolerance

5. Application Fields

  • Electronics Manufacturing: Circuit validation using oscilloscopes
  • Automotive: ECU communication via OBD-II ports
  • Medical Devices: Patient safety testing (IEC 60601 compliance)
  • Telecommunications: 5G base station signal monitoring
  • Aerospace: Avionics system diagnostics

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Keysight TechnologiesN2855A High-Z RF Probe
TektronixP6139B 500MHz Oscilloscope Probe
Fluke CorporationTPIL1 Test Point Interface Lead Set
AmphenolRF Test Port 6001-0001-0

7. Selection Guidelines

Key considerations include: - Match impedance and bandwidth to measurement equipment - Verify compliance with industry standards (e.g., IEEE, ISO 14001) - Environmental durability for operating conditions - Compatibility with automated test systems - Cost-benefit analysis of reusable vs. disposable probes

Example: Automotive manufacturers select test points with ISO 7637-2 compliance for reliable ECU testing in extreme temperature cycles.

8. Industry Trends

Emerging trends include: - Miniaturization for high-density PCBs (0.4mm pitch test points) - Integration with wireless test interfaces (Bluetooth/WiFi 6E) - Increased adoption of active probes for >10Gbps signal analysis - Smart test points with embedded sensors for real-time monitoring - Eco-friendly materials meeting RoHS/REACH regulations

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