Test Points

Image Part Number Description / PDF Quantity Rfq
02-24

02-24

Grayhill, Inc.

PC TEST POINT MINIATURE

1

11001-B

11001-B

Keystone Electronics Corp.

PC TEST POINT JACK BLACK

73230

5272

5272

Keystone Electronics Corp.

TEST POINT (WHITE) - COMPACT

41604400

6066

6066

Keystone Electronics Corp.

PC TEST POINT JACK WHITE

1800

RCSCTE

RCSCTE

KOA Speer Electronics, Inc.

TEST POINT CHIP

10000

8607-6VLT

8607-6VLT

E-Z-Hook

STANDARD HOOK VIOLET

0

8607-4YEL

8607-4YEL

E-Z-Hook

STANDARD HOOK YELLOW

0

6052

6052

Keystone Electronics Corp.

PC TEST POINT JACK GREEN

2001100

0943285001

0943285001

Woodhead - Molex

MICRO GROUND SPRING CONTACT SMT

0

8607-10VLT

8607-10VLT

E-Z-Hook

STANDARD HOOK VIOLET

0

02-20

02-20

Grayhill, Inc.

PC TEST POINT MINIATURE

0

6065

6065

Keystone Electronics Corp.

PC TEST POINT JACK BLUE

100

6057

6057

Keystone Electronics Corp.

PC TEST POINT JACK YELLOW

400

8607-6WTE

8607-6WTE

E-Z-Hook

STANDARD HOOK WHITE

0

8607-8BRN

8607-8BRN

E-Z-Hook

STANDARD HOOK BROWN

0

84-1

84-1

E-Z-Hook

STANDARD HOOK NATURAL

0

8607-6BLU

8607-6BLU

E-Z-Hook

STANDARD HOOK BLUE

0

8607-4BRN

8607-4BRN

E-Z-Hook

STANDARD HOOK BROWN

0

0040.1151.2

0040.1151.2

Schurter

PC TEST POINT JACK BLACK

0

395-93-101-03-380000

395-93-101-03-380000

Mill-Max

PC TEST POINT R/A BLACK

0

Test Points

1. Overview

Test points are standardized locations on electronic devices or systems designated for signal access, measurement, and diagnostic purposes. They serve as critical interfaces for validating performance, troubleshooting faults, and ensuring compliance with technical specifications. In modern electronics, test points enable efficient development, quality assurance, and maintenance across industries.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
PCB Test PointsDirect contact pads on printed circuit boardsPrototype validation, production line testing
High-Voltage ProbesInsulated contacts for >1kV measurementsPower supply testing, industrial equipment diagnostics
RF Test PointsImpedance-matched interfaces for high-frequency signalsWireless communication modules, antenna testing
Automotive Diagnostic PortsStandardized OBD-II connectorsVehicle ECU diagnostics, emission testing

3. Structure and Composition

Typical test points consist of: - Conductive contact materials (e.g., gold-plated copper, phosphor bronze) - Insulating housing with environmental protection (IP67-rated plastics) - Mechanical mounting features (through-hole/surface-mount) - Interface standards (BNC, SMA, USB-C, or proprietary connectors) - Optional protective covers with EMI shielding

4. Key Technical Specifications

ParameterSignificance
Max Current RatingDetermines power handling capability
Voltage RangeDefines operational safety limits
Frequency BandwidthSpecifies usable range for signal integrity
Contact ResistanceImpacts measurement accuracy (typically <10m )
Environmental ResistanceOperating temperature (-40 C to +125 C), humidity tolerance

5. Application Fields

  • Electronics Manufacturing: Circuit validation using oscilloscopes
  • Automotive: ECU communication via OBD-II ports
  • Medical Devices: Patient safety testing (IEC 60601 compliance)
  • Telecommunications: 5G base station signal monitoring
  • Aerospace: Avionics system diagnostics

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
Keysight TechnologiesN2855A High-Z RF Probe
TektronixP6139B 500MHz Oscilloscope Probe
Fluke CorporationTPIL1 Test Point Interface Lead Set
AmphenolRF Test Port 6001-0001-0

7. Selection Guidelines

Key considerations include: - Match impedance and bandwidth to measurement equipment - Verify compliance with industry standards (e.g., IEEE, ISO 14001) - Environmental durability for operating conditions - Compatibility with automated test systems - Cost-benefit analysis of reusable vs. disposable probes

Example: Automotive manufacturers select test points with ISO 7637-2 compliance for reliable ECU testing in extreme temperature cycles.

8. Industry Trends

Emerging trends include: - Miniaturization for high-density PCBs (0.4mm pitch test points) - Integration with wireless test interfaces (Bluetooth/WiFi 6E) - Increased adoption of active probes for >10Gbps signal analysis - Smart test points with embedded sensors for real-time monitoring - Eco-friendly materials meeting RoHS/REACH regulations

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