| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Pomona Electronics |
TEST CLIP SOIC 14 (2 X 7) |
19 |
|
 |
Pomona Electronics |
TEST CLIP PLCC 28 (4 X 7) |
4 |
|
 |
Pomona Electronics |
TEST CLIP SOIC 24 (2 X 12) |
14 |
|
 |
Pomona Electronics |
TEST CLIP SOIC 8 (2 X 4) |
702 |
|
 |
Pomona Electronics |
TEST CLIP PLCC 44 (4 X 11) |
0 |
|
 |
Pomona Electronics |
TEST CLIP PLCC 84 (4 X 21) |
2 |
|
 |
Pomona Electronics |
TEST CLIP PLCC 68 (4 X 17) |
3 |
|
 |
Pomona Electronics |
TEST CLIP DIP 14 (2 X 7) |
0 |
|
 |
Pomona Electronics |
TEST CLIP QFP 208 (4 X 52) |
0 |
|
 |
Pomona Electronics |
TEST CLIP DIP 24 (2 X 12) |
0 |
|
|
Pomona Electronics |
TEST CLIP DIP 14 (2 X 7) |
0 |
|
 |
Pomona Electronics |
TEST CLIP DIP 20 (2 X 10) |
0 |
|
 |
Pomona Electronics |
TEST CLIP DIP 16 (2 X 8) |
0 |
|
 |
Pomona Electronics |
TEST CLIP SOIC 40 (2 X 20) |
0 |
|
 |
Pomona Electronics |
TEST CLIP 24 (2 X 12) |
0 |
|
 |
Pomona Electronics |
TEST CLIP SOIC 32 (2 X 16) |
0 |
|
 |
Pomona Electronics |
TEST CLIP DIP 16 (2 X 8) |
0 |
|
 |
Pomona Electronics |
TEST CLIP QFP 144 (13 X 13) |
0 |
|
|
Pomona Electronics |
TEST CLIP QFP 44 (4 X 11) |
0 |
|
|
Pomona Electronics |
TEST CLIP SSOP 20 (2 X 10) |
0 |
|
Test Clips - IC are specialized electrical connectors designed to establish temporary connections between integrated circuits (ICs) and testing equipment. These clips enable signal transmission, power delivery, and data acquisition during semiconductor device validation and quality assurance processes. Their importance lies in ensuring reliable electrical contact without damaging sensitive IC packages, which is critical for precision measurements in electronics manufacturing and R&D.
| Type | Functional Features | Application Examples |
|---|---|---|
| Spring Probe Clips | Self-aligning spring-loaded contacts | Automated wafer-level testing |
| Surface Mount Clips | Low-profile design for SMD packages | PCB assembly verification |
| QFP/TQFP Clips | Peripheral lead contact system | Quad Flat Package testing |
| BGA Socket Clips | Array matrix contact points | Ball Grid Array device validation |
| SOIC Clips | Wide contact area for small-outline ICs | Consumer electronics prototyping |
Typical construction includes: - Contact Probes: Beryllium copper alloy with gold plating (0.8-3.0mm diameter) - Insulation Body: High-temperature resistant LCP polymer - Actuation Mechanism: Cam-driven or spring-assisted locking system - PCB Interface: Standard 2.54mm pitch pin headers - Material Properties: Operating temperature -40 C to +150 C, 106 mating cycles durability
| Parameter | Typical Range | Importance |
|---|---|---|
| Contact Resistance | 5-20 m | Signal integrity preservation |
| Current Rating | 1-5 A/contact | Power delivery capability |
| Frequency Range | DC-20 GHz | High-speed signal testing |
| Insertion Force | 0.5-3.0 N/contact | Device under test protection |
| Compatibility | JEDEC standard packages | Interchangeability assurance |
Key industries include: - Semiconductor manufacturing (wafer sort, final test) - PCB assembly inspection (ICT, functional testing) - Automotive electronics (ECU validation) - Consumer electronics (mobile device SoC testing) - Telecommunications (RFIC characterization) - Aerospace (radiation-hardened component screening)
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Keysight Technologies | U1211A IC Test Clip | 50GHz bandwidth, magnetic alignment |
| Tektronix | P6303A Logic Analyzer Clip | 24-channel differential probing |
| Erem Engineering | 0805-1-SM Surface Mount Clip | 0.4mm pitch capability |
| 3M | MicroSpring Interconnect | Anisotropic conductive film technology |
| Samtec | SEAM Series Socket | Self-stressing contact design |
Key considerations: - Match contact pitch (0.4mm to 2.54mm) with target IC package - Verify frequency response for high-speed applications - Evaluate thermal stability for burn-in testing - Confirm compatibility with test equipment interface - Calculate total insertion cycles versus cost/performance ratio
Current development directions: - Transition to sub-0.3mm contact pitch for advanced packaging - Integration of active components (amplifiers, attenuators) - Adoption of AI-driven contact condition monitoring - Miniaturization for 5G mmWave device testing - Increased adoption of modular clip systems - Growth in thermal management solutions for power device testing