| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
MG Chemicals |
ONE-PART EPOXY GENERAL PURPOSE A |
8 |
|
 |
MG Chemicals |
CARBON CONDUCTIVE PASTE |
0 |
|
 |
MG Chemicals |
SILVER CONDUCTIVE EPOXY, 4 HR PO |
5 |
|
 |
MG Chemicals |
CARBON CONDUCTIVE PASTE |
55 |
|
 |
MG Chemicals |
SILVER CONDUCTIVE EPOXY, 4 HR PO |
0 |
|
 |
MG Chemicals |
FLAME RETARDANT STRUCTURAL EPOXY |
11 |
|
 |
MG Chemicals |
BLACK RIGID POLYURETHANE POTTING |
1 |
|
|
MG Chemicals |
SILVER CONDUCTIVE EPOXY 4.52 OZ |
10 |
|
|
MG Chemicals |
EPOXY HIGH TEMP POTTNG/ENCAPS 3L |
0 |
|
|
MG Chemicals |
SILVER CONDUCTIVE EPOXY 0.52 OZ |
13 |
|
|
MG Chemicals |
EPOXY POTTING/ENCAPSULATING BLK |
0 |
|
|
MG Chemicals |
SILVER CONDUCTIVE EPOXY 0.52 OZ |
9 |
|
|
MG Chemicals |
EPOXY POTTING/ENCAPSULATING CLR |
0 |
|
|
MG Chemicals |
POTTING COMPOUND RED SPREADABLE |
0 |
|
|
MG Chemicals |
ADHESIVE SEAL SIL TRANS FLOWABLE |
12 |
|
|
MG Chemicals |
RTC SILICONE PRIMER |
0 |
|
|
MG Chemicals |
PRIMER FOR TWO PART SIL CLEAR |
0 |
|
|
MG Chemicals |
POTTING COMPOUND SELF LEVELING |
0 |
|
|
MG Chemicals |
HIGH TEMPERATURE RIGID URETHANE |
3 |
|
|
MG Chemicals |
HIGH TEMPERATURE RIGID POLYURETH |
2 |
|
Tapes, adhesives, and applicators are critical components in modern manufacturing and assembly processes. These materials enable permanent or temporary bonding between surfaces through mechanical adhesion, chemical bonding, or physical interlocking. Adhesives include liquid glues, pressure-sensitive tapes, and structural adhesives, while applicators encompass dispensing systems, spray equipment, and automated bonding machines. Their importance spans industries such as automotive, electronics, construction, and healthcare, offering advantages in weight reduction, vibration damping, and design flexibility.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Double-sided Tapes | High initial tack, permanent bonding | Signage mounting, automotive trim assembly |
| Foam Tapes | Gap-filling, vibration damping | Window glazing, HVAC sealing |
| Epoxy Adhesives | High strength, chemical resistance | Aerospace composite bonding |
| Hot Melt Adhesives | Fast curing, thermoplastic properties | Packaging, product assembly |
| Conductive Adhesives | Electrical continuity, EMI shielding | Flexible printed circuits |
Adhesive tapes typically consist of a carrier material (PET, foam, or fabric) coated with adhesive layers (acrylic, rubber, or silicone). Liquid adhesives contain polymers (epoxy, polyurethane), solvents or water carriers, and additives for specific properties. Applicators integrate precision dispensing valves, heated hoses, or robotic arms for controlled application. Pressure-sensitive adhesives require optimized viscoelastic properties to balance adhesion and cohesion forces.
| Parameter | Description | Importance |
|---|---|---|
| Tensile Strength | Maximum stress before failure (MPa) | Determines load-bearing capacity |
| Peel Adhesion | Bond strength between surfaces (N/cm ) | Affects joint durability |
| Cure Time | Time to reach full strength (minutes/hours) | Impacts production throughput |
| Temperature Resistance | Operating range (-50 C to 200 C) | Defines environmental suitability |
| Viscosity | Flow characteristics (cP) | Controls application method |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| 3M | Scotch Double Coated Tape 9448 | Acrylic adhesive, 1.2mm foam core |
| Henkel | Loctite EA 9466 | Epoxy adhesive for carbon fiber bonding |
| ITW | Devcon Plastic Welder | Two-part cyanoacrylate adhesive |
| BASF | Elastobond AP-310 | Waterborne adhesive for foam bonding |
| Nordson | ProEdge Dispensing System | High-precision adhesive application |
Key considerations include: - Required bond strength vs. substrates (metal, plastic, etc.) - Environmental exposure (temperature, humidity, chemicals) - Production speed requirements (fast curing vs. extended work time) - Application method compatibility (manual vs. automated) - Regulatory compliance (flammability, biocompatibility)
Current trends include: - Development of water-based and UV-curable adhesives for sustainability - Increased adoption of reactive hot melts in automotive assembly - Integration of smart dispensing systems with Industry 4.0 - Growth in electric vehicle battery bonding applications - Nanotechnology-enhanced adhesives for extreme environments