2D Materials

Part Number	Description / PDF	Quantity
S2D-24D3-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	3
S2D-18D3-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	3
SNS-C72-2525-50-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	6
S2D-24D2-0808-150-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	1
S2D-24B3-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: RECTANGULA	5
S2D-18C2-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	3
SNS-C16.5-2912-190-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	3
SNS-C20-0808-350-D45-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	3
SNS-C36-1212-110-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	9
S2D-18C2-0808-150-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	3
SNS-C18-2009-140-D50-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	3
SNS-C14.3-0808-350-D45-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	1
SNS-C20-0808-350-D60-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	3
S2D-24C2-0808-150-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	3
S2D-24C2-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	1
SNS-C24-1212-110-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	7
S2D-24C3-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	3
S2D-18B3-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: RECTANGULA	3
S2D-24D2-0808-350-P Finisar Corporation	2D SILICON NANOSTAMP: HEXAGONAL	4
SNS-C16.5-2924-190-P Finisar Corporation	LINEAR SILICON NANOSTAMP: PERIOD	3

2D Materials

1. Overview

Tapes, adhesives, and 2D materials are critical components in modern manufacturing and advanced technologies. Tapes are flexible materials coated with adhesives for bonding, sealing, or insulation. Adhesives are substances used to join materials by surface attachment. 2D materials are atomically thin materials (e.g., graphene, transition metal dichalcogenides) with exceptional electrical, mechanical, and thermal properties. These materials enable innovations in electronics, energy storage, automotive, and biomedical industries.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Pressure-Sensitive Tapes	Adhere with light pressure, removable/permament options	Electronic component fixation, packaging
Structural Adhesives	High load-bearing capacity, chemical resistance	Aerospace composite bonding
Graphene	High conductivity, strength (130GPa tensile strength)	Flex circuits, sensors
Molybdenum Disulfide (MoS )	Excellent lubrication, semiconducting properties	Transistors, catalysis

3. Structure and Composition

Tapes typically consist of a substrate (polyester, foam) with adhesive layers (acrylic, rubber). Adhesives may use epoxy, polyurethane, or silicone chemistries. 2D materials possess layered structures with weak interlayer bonds (van der Waals forces), enabling exfoliation into monolayers. Graphene's sp -carbon lattice provides superior mechanical (Young's modulus: 1TPa) and thermal conductivity (5000 W/m K).

4. Key Technical Parameters

Parameter	Significance	Typical Values
Peel Strength (N/mm)	Bond durability assessment	0.5-10 (tapes)
Shear Strength (MPa)	Load-bearing capacity	5-50 (adhesives)
Layer Thickness (nm)	Performance determinant for 2D materials	0.3-10 (graphene)
Electrical Conductivity (S/m)	Electronic application suitability	10 (graphene)

5. Application Fields

Key industries include:

Electronics: Flexible displays (graphene electrodes), chip packaging (conductive adhesives)
Automotive: Structural bonding (epoxy adhesives), EMI shielding (metal-coated tapes)
Energy: Solar panel assembly (UV-resistant tapes), battery electrodes (2D material composites)
Medical: Wound care dressings (hydrocolloid adhesives), biosensors (MoS transistors)

6. Leading Manufacturers and Products

Manufacturer	Representative Products
3M	VHB 4952 (acrylic foam tape), Scotch-Weld DP460 (structural adhesive)
Henkel	Loctite EA 9466 (aerospace adhesive), Bonderite coatings
Graphenea	CVD graphene sheets (95% monolayer purity)
2D Tech	MoS nanosheets for lubrication

7. Selection Recommendations

Key considerations: - Environmental resistance (temperature, UV exposure) - Mechanical requirements (flexibility vs. rigidity) - Electrical/thermal conductivity needs - Application-specific certifications (e.g., ISO 10993 for medical adhesives) - Cost-performance balance (e.g., graphene price vs. performance gains)

8. Industry Trends

Emerging developments include: - Bio-based adhesives for sustainability (e.g., soy-based epoxy) - Smart materials with stimuli-responsive properties (pH/temperature-sensitive tapes) - 2D heterostructures for advanced electronics (graphene-hBN vertical stacks) - Miniaturization demands driving nanoscale adhesive solutions - Increasing adoption in flexible electronics (wearables, foldable displays)