Configurable Switch Components - Lens

Image Part Number Description / PDF Quantity Rfq
LBW6A-L2R

LBW6A-L2R

IDEC

LBW EXT ILLD PB LENS KIT

0

LBW7A-L1W

LBW7A-L1W

IDEC

LBW FLUSH ILLD PB LENS KIT

0

61-9643.202

61-9643.202

EAO

CONFIG SWITCH LENS RED ROUND

0

92-956.400

92-956.400

EAO

LENS YELLOW 13,2X13,2 PLASTIC TR

0

5.49227.0051601

5.49227.0051601

RAFI

CONFIG SWITCH LENS BLUE ROUND

0

44-965.5

44-965.5

EAO

LENS CAP GREEN SHAPE 1

0

5.49263.0061002

5.49263.0061002

RAFI

CONFIG SWITCH LENS CLEAR SQUARE

0

A0261A

A0261A

APEM Inc.

CONFIG SWITCH LENS BLACK RECT

0

ALL3

ALL3

Altech Corporation

LENS ILL ACT 30 MM GRN

80

61-9842.6

61-9842.6

EAO

CONFIG SWITCH LENS BLUE ROUND

0

LBW6A-B2W

LBW6A-B2W

IDEC

LBW EXT BUTTONHEAD WHITE

0

A0261D

A0261D

APEM Inc.

CONFIG SWITCH LENS YELLOW RECT

0

2ALM6L

2ALM6L

Altech Corporation

LENS LED MUSHROOM OP 22MM BLUE

0

5.49263.0621900

5.49263.0621900

RAFI

LENS

0

A0163F

A0163F

APEM Inc.

CONFIG SWITCH LENS BLUE ROUND

0

03-923.9

03-923.9

EAO

LENS HALVED WHITE FLAT 17.5X18.3

0

5.49277.0041002

5.49277.0041002

RAFI

LENS TRANSP. COLOURLESS

0

5.72032.0310617

5.72032.0310617

RAFI

LENS

0

A0162D

A0162D

APEM Inc.

CONFIG SWITCH LENS YELLOW SQUARE

0

84-7111.711

84-7111.711

EAO

(84-7111.711) (84-7111.611) LENS

0

Configurable Switch Components - Lens

1. Overview

Configurable Switch Components - Lens refers to a category of modular electro-optical switching devices that integrate adjustable optical lens systems with customizable switching mechanisms. These components enable precise control of electrical circuits through optical signal modulation, combining mechanical actuation with light-based sensing technologies. Their importance in modern systems lies in enabling adaptive automation, high-precision detection, and non-contact operation across industrial, medical, and consumer electronics applications.

2. Major Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Adjustable Focus Lens SwitchesVariable focal length control with position feedbackMachine vision systems, robotic alignment
Multi-Spectrum Optical SwitchesDual-band IR/visible light operationSecurity sensors, optical communication
Programmable Matrix SwitchesSoftware-defined optical path routingTelecom networks, lab-on-chip devices
Environmental Resilient UnitsIP69K rated for harsh conditionsOutdoor automation, industrial IoT

3. Structural and Technical Composition

Typical construction includes: - Lens Assembly: Graded-index (GRIN) or aspheric lenses with anti-reflective coating - Actuation Mechanism: Piezoelectric, electromagnetic, or MEMS-based micro-actuators - Signal Interface: Standardized PCB mounting with configurable pinouts - Housing: Aluminum alloy or polycarbonate enclosures with thermal compensation - Control Circuitry: Integrated microcontrollers for parameter configuration

4. Key Technical Specifications

ParameterTypical RangeImportance
Wavelength Range400-1600nmDetermines optical compatibility
Switching Speed0.1-50msImpacts real-time performance
Resolution1-10 mCritical for precision applications
Operating Temperature-40 C to +125 CDefines environmental suitability
MTBF100,000 - 1,000,000 hoursMeasures long-term reliability

5. Application Fields

  • Industrial Automation: Conveyor sorting systems, CNC machine tools
  • Medical Equipment: Non-contact surgical instrument controllers
  • Telecommunications: Optical cross-connect systems
  • Consumer Electronics: Smart home sensors, AR/VR headsets

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
TE ConnectivityLensSwitch 7000IP67 rating, 0.5ms response time
Omron CorporationZW-F3 SeriesDual-beam stabilization, 50m detection range
HoneywellFS-Lens ProAI-driven adaptive focusing
Hamamatsu PhotonicsC12880MAMultispectral imaging integration

7. Selection Recommendations

Key considerations: - Environmental factors (temperature, vibration, contamination) - Optical requirements (wavelength sensitivity, light intensity) - Integration constraints (form factor, mounting options) - Control interface compatibility (analog/digital protocols) - Cost vs. performance trade-offs (Example: Semiconductor manufacturing requires Class 10 resolution)

8. Industry Trends Analysis

Emerging developments include: - Integration with edge AI for self-optimizing systems - Miniaturization through MOEMS (Micro-Opto-Electro-Mechanical Systems) - Adoption of plastic photonics for cost reduction - Increased use in autonomous vehicle LiDAR systems - Development of self-cleaning lens coatings using nanotechnology

RFQ BOM Call Skype Email
Top