Static Control Shielding Bags, Materials

Part Number	Description / PDF	Quantity
13826 EMIT	BAG SHLD MBB 12X18	77
13777 EMIT	MST BARRIER 22X20" 6.5MIL 100PK	8
12922 EMIT	BAG STATIC SHIELD MTL IN 15"X18"	141713
13488 EMIT	BAG SHIELD METAL-IN 10X26 100PC	30
13535 EMIT	BG STSHLD MTL-IN 22''X25'' 100EA	0
13536 EMIT	BG STSHLD MTL-IN 22''X28'' 100EA	0
13275 EMIT	BAG SHLD MET-OUT ZIP 10X14	51
12770 EMIT	BAG SHLD METL-IN ZIP 24X24	0
13605 EMIT	BAG ESD SHLD 3"X5" METAL-IN ZIP	8920462
13808 EMIT	BAG ESD VAPOR BARRIER 6"X10"	70023
PCL100810 EMIT	STATIC SHIELD BAG, PCL100 CLEAN	4
PCL100610 EMIT	STATIC SHIELD BAG, PCL100 CLEAN	3
13415 EMIT	BAG ESD SHIELD 4"X6" METAL-IN	126681743
13531 EMIT	BAG SHIELD METAL-IN 24X30	14
13816 EMIT	BAG ESD VAPOR BARRIER 10"X12"	3120
13315 EMIT	BAG SHLD MET-OUT ZIP 15X18	19
13424 EMIT	BAG SHIELD METAL-IN 4X26 100PC	0
13772 EMIT	MST BRRIER 10.5X18" 6.5MIL 100PK	10
13270 EMIT	BAG SHLD MET-OUT ZIP 10X12	38
12932 EMIT	STATIC SHIELD BAG,81705 SERIES M	104

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.