Static Control Shielding Bags, Materials

Image	Part Number	Description / PDF	Quantity	Rfq
	13345 EMIT	BG STTSHLD MTL-IN 4''X8'' 100EA	0
	13359 EMIT	BG STTSHLD MTL-IN 6''X26'' 100EA	0
	13335 EMIT	BG STTSHLD MTL-IN 8''X10'' 100EA	0
	13330 EMIT	BG STTSHLD MTL-IN 3''X5'' 100EA	0
	13389 EMIT	BG STSHLD MTL-IN 15''X18'' 100EA	0
	48505 EMIT	BAG 8300 METAL OUT 3MIL 8X8	0
	13373 EMIT	BG STSHLD MTL-IN 10''X16'' 100EA	0
	13348 EMIT	BG STTSHLD MTL-IN 4''X30'' 100EA	0
	48503 EMIT	BAG 8300 METAL OUT 3MIL 6X8	0
	13365 EMIT	BG STTSHLD MTL-IN 7''X11'' 100EA	0
	48516 EMIT	BAG 8300 METAL OUT 3MIL 18X24	0
	13383 EMIT	BG STSHLD MTL-IN 12''X25'' 100EA	0
	13338 EMIT	BG STSHLD MTL-IN 10''X14'' 100EA	0
	12768 EMIT	BAG SHLD METL-IN ZIP 18X18	0
	49107 EMIT	BAG PINK POLY 4MIL 6X9 NO ZIP	0
	12762 EMIT	BAG SHLD METL-IN ZIP 10X24	0
	12783 EMIT	BAG ESD SHIELD 8X10 METAL-IN GRN	0
	12753 EMIT	BAG SHLD METAL-IN ZIP 4X24	0
	13361 EMIT	BG SHLD MTL-IN 6.5''X10'' 100EA	0
	12702 EMIT	BAG SHLD METAL-IN 4X6	0

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.