Static Control Shielding Bags, Materials

Part Number	Description / PDF	Quantity
48606 EMIT	BAG ESD SHLD 10X14 METAL-IN GRN	0
12790 EMIT	BAG ESD SHLD 18X18 METAL-IN GRN	150
12804 EMIT	ESD SHLD BUBBLE BAG 12X17 10PK	0
13020 EMIT	BAG SHIELD METAL-OUT 4X6	280
12816 EMIT	ESD SHLD BUBBLE BAG 12X11 10PK	0
13924 EMIT	BG MBB FOIL 4MIL 10X25" 100EA/PK	0
12807 EMIT	ESD SHLD BUBBLE BAG 12X11 10PK	0
12784 EMIT	BAG ESD SHIELD 8X12 METAL-IN GRN	0
12803 EMIT	ESD SHLD BUBBLE BAG 9X12 10PK	0
12785 EMIT	BAG ESD SHLD 10X12 METAL-IN GRN	0
48502 EMIT	BAG 8300 METAL OUT 3MIL 5X8	0
12802 EMIT	ESD SHLD BUBBLE BAG 8X11 10PK	0
12791 EMIT	BAG ESD SHLD 18X24 METAL-IN GRN	31
13065 EMIT	BAG SHIELD METAL-OUT 8X10	90
12718 EMIT	BAG SHLD METAL-IN 8X24	0
13353 EMIT	BG STTSHLD MTL-IN 6''X9'' 100EA	0
48005 EMIT	BAG 4150 METAL IN 3MIL 6X14	0
13374 EMIT	BG STSHLD MTL-IN 10''X18'' 100EA	26
13384 EMIT	BG STSHLD MTL-IN 12''X30'' 100EA	0
12712 EMIT	BAG SHLD METAL-IN 8X8	0

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.