Static Control Grounding Mats

Part Number	Description / PDF	Quantity
2059USA-2X5GKT Bertech	2'X5' ESD SOLDERING MAT KIT USA	20
1059-2X3BKT Bertech	2'X3' - ESD MAT KIT, USA, BLUE	50
2059USA-3X5BKT Bertech	3'X5' ESD SOLDERING MAT KIT USA	4
66227 EMIT	DL RBBR MT GR .060''X36''X72'' G	0
1059-20X24GKT Bertech	20"X24" - ESD MAT KIT, USA, GRAY	100
8840 SCS	TABLE RUNNER GRAY 2' X 24'	0
66065 EMIT	RUBBER DISS BEIGE .060 36X40'	0
2059T-20X30GNKT Bertech	20"X30" ESD HIGH TEMPERATURE MAT	0
ESDFM-2X5BKT Bertech	2'X5' - ESD FOAM MAT KIT, USA	10
66441 EMIT	MAT KIT, STATFREE T2 PLUS RUBBER	6
66075 EMIT	RUBBER DISS BLUE .060 36X40'	7
MTLP3672RB Transforming Technologies	36" X 72" X .060", ROYAL BLUE	50
3059-20X24GKT Bertech	20"X24" ESD VINYL MAT KIT USA	10
4513235100 M+A Matting	HOG HEAVEN KIT 7/8 3'X5' STRIPE	500
1059-3X5GKT Bertech	3'X5' - ESD MAT KIT, USA, GRAY	50
15014 EMIT	FLOOR MAT PVC BLACK 6' X 4'	1015
MT2472GN Transforming Technologies	24" X 72" X .080", GREEN	50
2059S-20X30BKT Bertech	20"X30" ESD SOLDERING MAT KIT	100
8251 SCS	FLOOR MAT ESD DISSP 3-LAYER BRN	2
MTLP3660RB Transforming Technologies	36" X 60" X .060", ROYAL BLUE	50

Static Control Grounding Mats

1. Overview

Static Control Grounding Mats are specialized materials designed to prevent electrostatic discharge (ESD) by providing a controlled path to ground. They are critical components in environments where sensitive electronic components, precision manufacturing processes, or contamination-sensitive operations (e.g., cleanrooms) are present. By dissipating static charges safely, these mats protect equipment, ensure product reliability, and comply with international ESD safety standards (e.g., ANSI/ESD S20.20, IEC 61340-5-1).

2. Main Types & Functional Classification

Type	Functional Characteristics	Application Examples
Conductive Rubber Mats	Low resistance (10 10 ), rapid charge dissipation	Semiconductor assembly lines, cleanrooms
Anti-Static PVC Mats	Surface resistivity 10 10 , moderate ESD protection	Electronics packaging, light industrial use
Multi-Layer Composite Mats	Hybrid structure with wear-resistant top layer and conductive bottom layer	Aerospace component manufacturing
High-Temperature Resistant Mats	Operational up to 150 C, chemical-resistant coatings	Automotive electronics soldering stations

3. Structure & Composition

A typical grounding mat consists of three layers:

Top Layer: Electrostatic dissipative (ESD) coating (e.g., carbon-infused polymer) for surface charge control.
Conductive Layer: Embedded copper/nickel mesh or conductive rubber for low-resistance grounding.
Base Layer: Dielectric insulating material (e.g., polyvinyl chloride) for environmental isolation.

Connection hardware includes banana jacks (4mm/10mm) and braided ground cords with 1M current-limiting resistors for safety compliance.

4. Key Technical Specifications

Parameter	Typical Range	Importance
Surface Resistivity	10 10	Determines charge dissipation rate
Decay Time	<5 seconds (per MIL-STD-1686)	Measures speed of static neutralization
Wear Resistance	100,000+ cycles (Taber Abraser test)	Longevity in high-traffic areas
Operating Temperature	-20 C to 120 C	Environmental stability
Chemical Resistance	Resists IPA, acetone, mild acids	Compatibility with cleaning agents

5. Application Fields

Semiconductor Manufacturing: Wafer bonding stations, photolithography equipment
Medical Device Assembly: Pacemaker production lines, surgical instrument packaging
Aerospace: Avionics component handling, satellite testing facilities
Pharmaceuticals: Cleanroom environments for sterile drug production
Data Centers: Server maintenance platforms with ESD-sensitive hardware

6. Leading Manufacturers & Products

Manufacturer	Representative Product	Key Features
3M	8210+ ESD Mat	Triple-layer design, 10 resistivity, RoHS compliant
Honeywell	FM1000 Conductive Mat	Embedded carbon grid, 5-year durability guarantee
Desco Industries	10350 AlphaMat	Self-healing surface, 10 resistance
Statimat	SM-1200HR	High-temperature resistance up to 150 C

7. Selection Guidelines

Assess ESD sensitivity level of the environment (per IEC 61340-5-1 classification).
Verify compliance with local standards (e.g., UL, CE, NFPA 99).
Consider mechanical stress factors (foot traffic, equipment weight).
Check chemical exposure requirements (cleaning agents, solvents).
Calculate coverage area with 15-20% overlap for grounding continuity.

Case Study

A semiconductor fabrication plant in Taiwan reduced device failure rates by 37% after replacing conventional mats with 3M 8210+ mats, which achieved 95% static charge neutralization within 2 seconds.

8. Industry Trends

Nanomaterial Integration: Graphene-enhanced composites for sub-10 resistivity
Smart Monitoring: Mats with embedded IoT sensors for real-time resistance tracking
Sustainability: Biodegradable PVC alternatives and recyclable conductive polymers
Standardization: Harmonization of MIL-STD, IEC, and ESDA guidelines for global manufacturing

Forecasts indicate 8.2% CAGR in the ESD control market through 2030, driven by EV battery production and 5G infrastructure demands.