Static Control Device Containers

Image	Part Number	Description / PDF	Quantity	Rfq
	38520 EMIT	CIRCUIT BD SHPR EECCOO 22X15X3	0
	37243 EMIT	ESD HANDLER 6-3/4X14-5/8X1	0
	37314 EMIT	ESD HANDLER 6-3/4X16X2-1/4	0
	37215 EMIT	ESD HANDLER 18-1/4X10X2-1/4	0
	39310 Protektive Pak	CNTNR 18-5/8X15X12	0
	37179 EMIT	ESD HANDLER 12-5/8X4-5/8X1	0
	37252 EMIT	ESD HANDLER 10-3/4X14-5/8X2-3/8	0
	39313 Protektive Pak	CNTNR 22-7/8X12-7/8X8	0
	38500 EMIT	CIRCUIT BD SHPR EECCOO 4X4X2-1/8	0
	37320 EMIT	ESD HANDLER 17-1/8X7-3/4X1	0
	37245 EMIT	ESD HANDLER 6-3/4X4-5/8X1	0
	37781 Protektive Pak	CARRIER LEAD CHIP 12-9/16X4X7/16	0
	37519 EMIT	STORAG CONT 18-3/8X12-3/8X14-3/4	0
	37170 EMIT	ESD HANDLER 11-1/4X14-3/4X3/4	0
	47510 EMIT	CARD HOLDER STAT DISS 4X2 100PK	0
	38551 EMIT	BOX OPEN BIN 9X4X4-1/2	0
	37217 EMIT	ESD HANDLER 18-1/4X10X1	0
	38552 EMIT	BOX OPEN BIN 12X2X4-1/2	0
	38503 EMIT	CIRCUIT BD SHPR 9X7-1/2X2-1/2	0
	38508 EMIT	CIRCUIT BD SHPR 14-7/8X6-5/8X2	0

Static Control Device Containers

1. Overview

Static Control Device Containers are specialized enclosures designed to store, transport, or manage electrostatic discharge (ESD)-sensitive devices. They mitigate risks of ESD damage in environments like semiconductor manufacturing, electronics assembly, and cleanrooms. These containers integrate materials and designs that neutralize static charges, prevent particle contamination, and ensure compliance with international standards (e.g., IEC 61340-5-1). Their importance is critical in modern technologies where microelectronics and nanoscale components are vulnerable to sub-micron particulates and electrostatic fields.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Conductive Polymer Containers	Surface resistivity 10 10 , permanent charge dissipation	IC trays in SMT lines
Antistatic Coated Containers	Surface resistivity 10 10 , temporary ESD protection	PCB storage in R&D labs
Ionization-Integrated Units	Active neutralization of isolated charges via corona discharge	Wafer handling in Class 10 cleanrooms
Faraday Cage Containers	Electromagnetic shielding attenuation >60dB	Military/aerospace component storage

3. Structure and Components

Typical construction includes: - Base Material: Carbon-loaded polypropylene or dissipative ABS polymer - Shielding Layer: Sputtered aluminum coating (thickness 50 200nm) - ESD Mechanism: Embedded carbon nanotube networks or quaternary ammonium compounds - Containment Design: Interlocking lids with gasket seals (particulate retention >99.97% at 0.3 m) - Grounding Interface: 10mm diameter brass stud with <4 resistance

4. Key Technical Specifications

Parameter	Value/Range	Significance
Surface Resistance	10 10 /sq	Determines charge dissipation rate
Decay Time	0.5 seconds @ 1kV	Measures static neutralization efficiency
Shielding Effectiveness	30 100MHz: >40dB	Protects against electromagnetic interference
Particulate Emission	<10 particles/ft >0.5 m	Ensures cleanroom compliance

5. Application Fields

Primary industries include: - Semiconductor manufacturing (e.g., AMAT Centura platforms) - Medical device assembly (ISO 14644-1 certified facilities) - Aerospace electronics (MIL-PRF-81705D compliant systems) - Data centers (server rack ESD control) - Precision optics (particle-sensitive lens handling)

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
3M Electronic Solutions	SCD-450X	Self-ionizing polymer matrix
Omega Engineering	ESD-COMB2023	Integrated humidity control
Snap-on Industrial	TST-7800PRO	Modular Faraday cage design
LPKF Laser Electronics	CAD-KIT2	Customizable conductive dividers

7. Selection Recommendations

Key considerations: - Environmental operating range (-40 C to +125 C for automotive applications) - Load capacity (static vs. dynamic storage needs) - Regulatory compliance (JEDEC J-STD-033D, ANSI/ESD S541) - Integration with automated handling systems (SEMI E14-0703 compatibility) - Total cost of ownership (cleaning/maintenance intervals)

8. Industry Trends

Current developments focus on: - Nanocomposite materials with graphene-enhanced conductivity - IoT-enabled containers with real-time ESD monitoring - Biodegradable antistatic polymers for RoHS compliance - AI-driven charge prediction algorithms - Miniaturization for 3nm process node component handling

9. Case Study: Semiconductor Production

A 12-inch wafer fabrication plant implemented ionization-integrated containers, achieving 99.3% reduction in ESD-related yield loss. The solution incorporated self-diagnostic sensors meeting SEMI E121-0602 standards, with automated reporting to the facility's MES system.