Clean Room Treatments, Cleaners, Wipes

Image Part Number Description / PDF Quantity Rfq
2011-B

2011-B

3M

CLEANING CLOTH GENERAL PURP 1=1

103

8001

8001

3M

CLEANER MARK REMOVER ANTISTATIC

176

2011-W

2011-W

3M

CLEANING CLOTH GENERAL PURP 1=1

379

9021

9021

3M

ELECTRONICS MICROFIBER CLEANING

0

55938

55938

3M

EASY II HOLDER 59"

0

19151

19151

3M

DOODLEDUSTER HOLDER LARGE 38"

0

55936

55936

3M

EASY II HOLDER 35"

0

CL610

CL610

3M

ANTISTATIC WIPES CL610

0

19152

19152

3M

DOODLEDUSTER CLOTH 7"

0

55937

55937

3M

EASY II HOLDER 47"

0

19150

19150

3M

DOODLEDUSTER HOLDER SMALL 25"

0

55934

55934

3M

EASY II HOLDER 17"

0

05-00017

05-00017

3M

LINT FREE CLOTH 1=1PC

0

2011-R

2011-R

3M

CLEANING CLOTH GENERAL PURP 1=1

0

CSSC20-M100

CSSC20-M100

3M

CLEANING WIPES

0

60929

60929

3M

HE FLTR MRCY VAPOR CHLORINE CART

0

55656

55656

3M

EASY II HOLDER REPLACEMENT MATER

0

06839

06839

3M

3M BOOTH COATING IS A WATER-

0

06837

06837

3M

DUST CONTROL SPRAY 1GAL

0

CL630

CL630

3M

CLEANER NOTEBOOK SCREEN CLEANING

0

Clean Room Treatments, Cleaners, Wipes

1. Overview

Cleanroom products are specialized materials designed to maintain contamination control in controlled environments. Static control and ESD (Electrostatic Discharge) protection products prevent damage from static electricity, while cleanroom treatments, cleaners, and wipes ensure particulate and microbial contamination removal. These products are critical in semiconductor manufacturing, pharmaceuticals, aerospace, and biotechnology industries where nanoscale precision and sterility are required.

2. Main Types and Functional Classification

TypeFunctionalityApplications
ESD MatsDissipate static charges from personnel/equipmentElectronics assembly lines
IonizersNeutralize static charges in non-conductive materialsPhotolithography processes
Conductive WipesRemove particles while preventing static buildupOptical component cleaning
pH-Neutral CleanersRemove organic/inorganic contaminants without surface damageMedical device manufacturing

3. Structure and Composition

Cleanroom wipes typically use nonwoven synthetic fibers (e.g., polyester, nylon) with edge-binding technology to prevent fiber shedding. Cleaners contain deionized water, surfactants, and chelating agents. ESD products incorporate conductive polymers or carbon additives. Surface treatments often use perfluoropolyether (PFPE) coatings for low particle adhesion.

4. Key Technical Specifications

ParameterRequirementSignificance
Surface Resistivity10^6-10^9 /sqESD protection efficiency
Particle Release<1000 particles 0.5 m/cm Cleanroom classification compliance
Non-Volatile Residue<1mg/m Prevents optical/electronic interference
pH Range5.5-7.5Material compatibility assurance

5. Application Areas

  • Semiconductor: Wafer handling, photomask cleaning
  • Pharmaceutical: Aseptic filling line maintenance
  • Aerospace: Precision sensor contamination control
  • Medical Devices: ISO Class 7 cleanroom operations

6. Leading Manufacturers

ManufacturerKey ProductFeatures
3MScotch-Wel ESD WipesCarbon-impregnated polyester matrix
HoneywellMaxGuard Cleanroom CleanerLow VOC, fast-evaporating formula
Kimberly-ClarkKimWipes CR-TX10099.99% particle removal efficiency

7. Selection Guidelines

Consider chemical compatibility with target surfaces, required cleanliness class (ISO 14644-1), ESD protection level (IEC 61340-5-1), and regulatory certifications (FDA, REACH). For critical processes, perform particle extraction testing using scanning electron microscopy.

8. Industry Trends

Key developments include: - Nanoparticle-enhanced cleaning formulations - Self-diagnostics ESD materials with embedded sensors - Biodegradable wipes using polylactic acid (PLA) - AI-powered contamination monitoring systems integration

Case Study: In a 5nm semiconductor fab, implementation of PFPE-coated wipes reduced particle defects by 47% while maintaining surface resistivity below 10^8 /sq.

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