Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
EB14HH

EB14HH

END BRUSH; HH FILL; STEEL BODY

0

CCT2425

CCT2425

ITW Chemtronics (Chemtronics)

SWAB DBL HEAD COTTON 3" 5000PC

0

36089

36089

Tronex (Menda/EasyBraid/Tronex)

ESD BRUSH, CONDUCTIVE, ROUND ALU

221

6021-01000

6021-01000

SIZE 1 HH ROUND ARTIST; WOOD HDL

0

0907-00300

0907-00300

SZ 3/0 CR PUR RED SAB RD AR; WD

0

SW5PF-10

SW5PF-10

Tronex (Menda/EasyBraid/Tronex)

SWAB 5" REC FM TP 10/PKG

0

11NAG-12

11NAG-12

HL TOOTHBRUH; NYL FILL; ALUM HDL

0

26122F

26122F

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD FOAM 6" 450PC

0

1010NG-12

1010NG-12

APPLICATOR: NYL FILL; STL HNDL

0

0036-10000

0036-10000

SIZE 10 TAKLON RD ARTIST; WD HDL

0

BT202N

BT202N

APPLICATOR: NYL FILL; BRASS HNDL

0

0316-02000

0316-02000

SIZE 2 HOG ROUND ARTIST; WOOD HD

0

33NAG-12

33NAG-12

HL TOOTHBRUSH; NY FILL; ALUM HDL

0

SST10TEF

SST10TEF

APPLICATOR: PTFE FILL; SS HANDLE

0

0770-09000

0770-09000

SIZE 9 SABLE ROUND ARTIST; WD HD

0

0790-01050

0790-01050

SIZE 1-1/2" CAML FLAT ART; WD HD

0

BT203N

BT203N

APPLICATOR: NYL FILL; BRASS HNDL

0

0987-00062

0987-00062

SIZ 5/8" BK HOG FITCH ART; WD HD

0

901332

901332

3/8" FLOW-THRU; HH FILL; FEMALE

0

0611-10000

0611-10000

SIZE 10 SAB SHADER ARTIST; WD HD

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

RFQ BOM Call Skype Email
Top