Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
23222

23222

SIZE 10 NYLON STRIP BRUSH, 2" HT

0

21050ESD

21050ESD

ITW Chemtronics (Chemtronics)

COVENTRY ESD WRAPPED POINTED FOA

2

SST2S9

SST2S9

APPLICATOR: SD NYL FILL; SS HNDL

0

44766

44766

SIZE 7 SS STRIP BRUSH, 2" HT

0

36094

36094

Tronex (Menda/EasyBraid/Tronex)

ESD BRUSH, DISSIPATIVE, FLAT HAN

3332

901332G

901332G

3/8" FLOW-THRU; GOAT FILL; FMALE

0

499NPG

499NPG

APPLICATOR: NYL FILL; PLAST HNDL

0

499S9XG-12

499S9XG-12

APPLICATOR; SD NYL FILL; STL HDL

0

38540ESD

38540ESD

ITW Chemtronics (Chemtronics)

COVENTRY ESD SUPER THIN FLEXIBLE

14

906500SDX

906500SDX

INSTR CLNR; SD NY FILL; PL HNDLE

0

442CSG

442CSG

SCRATCH BRUSH; CS FILL; WOOD HDL

0

38542F

38542F

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLY NONWOVN 900PC

0

WA7GG-12

WA7GG-12

APPLICATOR: GOAT FILL; WOOD HNDL

0

812AS-250

812AS-250

MG Chemicals

SWAB ANTISTATIC FOAM OVER COTTON

0

FTRS-22

FTRS-22

22GA; FT LUER LOCK; RED SAB FILL

0

0906-01000

0906-01000

SIZE 1 PUR RED SAB RD ART; WD HD

0

SST10PP

SST10PP

APPLICATOR: POLY FILL; SS HANDLE

0

51353

51353

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLY KNIT 1000PC

0

44788

44788

SIZE 7 BRASS STRIP BRUSH, 4" HT

0

441SSG

441SSG

SCRATCH BRUSH; SS FILL; WOOD HDL

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

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