Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
9162CK

9162CK

BLOCK BRUSH; HOG FILL; WOOD BASE

0

23125

23125

SIZE 4 NYLON STRIP BRUSH, 4" HT

0

11SDA

11SDA

HL TOOTHBRUSH; SD NY FILL; AL HD

0

906503SDX

906503SDX

INSTR CLNR; SD NY FILL; PL HNDLE

0

901820L

901820L

BOWL BRUSH; SD NY FILL; PL HNDLE

0

6999-00800

6999-00800

SIZE 8/0 PUR RED SABL RND; WD HD

0

403CSG

403CSG

SCRATCH BRUSH; CS FILL; WOOD HDL

0

403SS-006G

403SS-006G

SCRATCH BRUSH; SS FILL; WOOD HDL

0

35696

35696

Tronex (Menda/EasyBraid/Tronex)

ESD BRUSH COND FLAT BLACK 1/2"

1748

906503

906503

INSTR CLNR; NYL FILL; PLAST HDLE

0

SST10TG-12

SST10TG-12

APPLICATOR: THUND FILL; SS HNDLE

0

36850

36850

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLY KNIT 2500PC

0

6021-03000

6021-03000

SIZE 3 HH ROUND ARTIST; WOOD HDL

0

FTN-16

FTN-16

16GAUGE; FT LUER LOCK; NYL FILL

0

299991-5/16

299991-5/16

PLATER'S BRUSH; HH FILL; WOOD HD

0

44759

44759

SIZE 4 SS STRIP BRUSH, 6" HT

0

414HHG

414HHG

PLATER'S BRUSH; HH FILL; WD HDLE

0

111SSG-12

111SSG-12

TOOTHBRUSH; SS FILL; WOOD HANDLE

0

SST2P

SST2P

APPLICATOR: PEEK FILL; SS HANDLE

0

SST6SSG-12

SST6SSG-12

APPLICATOR: SS FILL; SS HANDLE

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

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