Soldering, Desoldering, Rework Tips, Nozzles

Image Part Number Description / PDF Quantity Rfq
N3-08

N3-08

Hakko

NOZZLE,0.8MM,FM-2024

11

T35-02D1

T35-02D1

Hakko

MICRO CHISEL TIP FOR USE WITH FX

6

T18-D24/P

T18-D24/P

Hakko

TIP,2.4D,FX-8801,907/900M/913,GL

0

A1131

A1131

Hakko

NOZZLE,SOP,10 X 4.8MM,FR-803B/80

0

T35-02KU

T35-02KU

Hakko

MICRO KNIFE TIP FOR USE WITH FX-

5

A1129B

A1129B

Hakko

NOZZLE,QFP,28.2 X 28.2MM,FR-803B

0

A1259B

A1259B

Hakko

NOZZLE,SOP,29.0 X 13.5MM,FR-803B

0

T22-C6

T22-C6

Hakko

TIP,BEVEL,6MM/45 X 10MM,HD,FM-20

0

B2902

B2902

Hakko

ASSY,NOZZLE,N2,T17-KR,FM-2026

0

900L-T-5CF

900L-T-5CF

Hakko

TIP,5CF,900L/908/914

0

980-T-BC

980-T-BC

Hakko

TIP,BC,PRESTO,980/981

0

900L-T-I

900L-T-I

Hakko

TIP,I,900L/908/914

0

EB6

EB6

Hakko

TIP,B,6 X 85MM,503/915

0

T18-CF15

T18-CF15

Hakko

TIP,1.5CF,FX-8801,907/900M/913

0

N51-11

N51-11

Hakko

NOZZLE BGA 6X6

0

918-T-4C/P

918-T-4C/P

Hakko

TIP,4C,MACH,918,GLD

0

T22-D12

T22-D12

Hakko

TIP,CHISEL,1.2 X 10MM,HD,FM-2031

0

485-N-17

485-N-17

Hakko

NOZZLE,11 X 27MM,CROSS,18/20 PIN

0

A1133

A1133

Hakko

NOZZLE,SOP,16 X 7.2MM,FR-803B/80

0

T34-C4

T34-C4

Hakko

TIP,4C,FX-650

0

Soldering, Desoldering, Rework Tips, Nozzles

1. Overview

Soldering, desoldering, and rework products are essential tools for electronic assembly and repair. These tools enable precise heating and removal of solder joints to ensure reliable electrical connections. Their importance has grown with advancements in miniaturization, high-density PCB designs, and quality control requirements in modern manufacturing.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Conical TipsPointed geometry for precision heating0.4mm pitch SMD components
Chisel TipsWide contact area for heat distributionThrough-hole component soldering
Needle TipsUltra-fine tip for micro-solderingFlip-chip bonding
Flat NozzlesUniform heating for multiple jointsBGA component rework
High-temp NozzlesSpecial alloys for >400 C operationsLead-free solder processing

3. Structure & Composition

Typical products feature: - Heating element (ceramic PTC or nichrome coil) - Thermocouple for closed-loop temperature control - Iron-plated copper core with anti-oxidation coating - Modular interface (900M/900HT standard) - ESD-safe handle assembly

4. Key Technical Specifications

ParameterSignificance
Temperature range (180-450 C)Determines material compatibility
Thermal recovery rate ( C/s)Affects productivity in high-volume work
Temperature stability ( 5 C)Ensures process repeatability
Thermal conductivity (W/m K)Impacts energy efficiency
Interchange cycle ratingDirectly relates to tool longevity

5. Application Fields

Primary industries: - Consumer electronics (smartphones, wearables) - Automotive electronics (ECUs, sensors) - Aerospace (avionics systems) - Medical devices (implantable equipment) - Industrial automation (PLCs) Case Example: Automotive radar systems use flat nozzles for simultaneous heating of 128 RF module connections.

6. Leading Manufacturers & Products

ManufacturerFlagship ProductKey Features
MetcalSmartHeat MX-5000160 C recovery rate
JBCC245 SMD Rework Station 2 C stability
HakkoT12 Precision Tip5-second tip replacement
OK International938ESD Soldering StationIntegrated smoke extraction

7. Selection Guidelines

Consider: - Application type (precision vs. bulk soldering) - Required temperature profile - Tool interface compatibility - Tip lifespan requirements - ESD protection needs - Calibration maintenance costs

8. Industry Trends

Key developments: - Automated soldering robots with AI temperature control - Nano-coated tips reducing oxidation by 70% - Integration with IoT-enabled process monitoring - Shift toward lead-free and halogen-free materials - Miniaturization for 01005 component compatibility

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