Soldering, Desoldering, Rework Stations

Part Number	Description / PDF	Quantity
FM206-STA Hakko	REWORK SOLDER STA 410W 3 CH 120V	4
FX300-03 Hakko	SOLDER POT 280W 120V	29
FR872-03 Hakko	PREHEATING PLATE 1440W 120V	13
FX791-01 Hakko	N2 STATION,CONTROLLER,FX-791	0
FR410-53 Hakko	DESOLDERING STATION	42
FM204-01 Hakko	DESOLDER SLDR STA 120W 1 CH 120V	18
FM206-DSS Hakko	SOLDER REWORK STA 410W 3 CH 120V	6
FR810B-05 Hakko	REWORK STATION 820W 1 CH 120V	61
FX951-66 Hakko	SOLDERING STATION 75W 1 CH 120V	335
FX301B-03 Hakko	SOLDER POT 215W 120V	40
FM203-HD Hakko	SOLDERING STATION 140W 2 CH 120V	36
FR830-02 Hakko	PREHEATING PLATE 470W 120V	53
FM2024-42 Hakko	CK,DSDRG,W/FH-200,W/O NOZZLE,FM-	0
FM203-01 Hakko	SOLDERING STATION 140W 2 CH 120V	55
FX888D-23BY Hakko	STATION,SDRG,DIGITAL,ESD,FX-8801	0
FX801-02 Hakko	STATION,SDRG,260W,UHD,ESD,W/O TI	0
FM205-01 Hakko	DESOLDER SOLDR STA 80W 1 CH 120V	7
373-11 Hakko	BASE,SDRG,FEEDER,373	0
FM206-55 Hakko	REWORK STATION 410W 3 CH 120V	8
FM203-DP Hakko	SOLDERING STATION 140W 2 CH 120V	6

Soldering, Desoldering, Rework Stations

1. Overview

Soldering, desoldering, and rework stations are essential tools in electronics manufacturing and repair. These systems enable precise joining (soldering), removal (desoldering), and modification (rework) of electronic components on printed circuit boards (PCBs). With miniaturization of electronic devices and increasing complexity of surface-mount technology (SMT), these stations ensure high-quality connections while minimizing thermal damage to sensitive components. Their importance spans industries from consumer electronics to aerospace, where reliability and precision are critical.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Soldering Stations	Temperature-controlled soldering irons, hot-air systems, and infrared heating	PCB assembly, fine-pitch component soldering
Desoldering Stations	Vacuum pumps for solder removal, temperature-sensitive desoldering tips	Component replacement, PCB repair
Rework Stations	Multi-functional platforms combining soldering/desoldering with precision control	BGA/QFN package rework, prototype modifications

3. Structure and Components

Typical systems consist of: - Control Unit: Digital interface for temperature, airflow, and timing adjustments - Heating Element: Ceramic or carbon heating systems with rapid thermal response - Handpiece: Ergonomic design with interchangeable tips (soldering iron, hot-air nozzle) - Vacuum System: For desoldering applications (in integrated stations) - Temperature Sensors: Closed-loop feedback for 1 C accuracy

4. Key Technical Specifications

Parameter	Description
Temperature Range	100-450 C (standard), extended ranges available for specialty applications
Thermal Recovery	Ability to maintain set temperature under thermal load (critical for SMT)
Power Output	50-200W depending on application requirements
Nozzle Compatibility	Interchangeable nozzles for different component sizes (0.3mm to 5mm)
ESD Safety	Electrostatic discharge protection for sensitive electronics

5. Application Fields

- Consumer Electronics: Smartphone assembly (e.g., Apple iPhone motherboard repair) - Automotive: Engine control unit (ECU) manufacturing and repair - Medical Devices: Pacemaker PCB assembly requiring Class III IPC standards - Aerospace: Avionics systems with MIL-STD-2000A compliance - Prototyping: R&D labs for rapid circuit modifications

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Metcal	SX800 Selectable Output Series	SmartHeat technology with 256 temperature profiles
JBC	CD 2B Plus Rework Station	Modular design with instant heating cartridges
Aoyue	968A+ Soldering Station	Advanced PID control, ESD-safe construction

7. Selection Recommendations

Consider: - Application type (precision SMT vs. heavy-duty repair) - Temperature stability requirements ( 2 C for BGA rework) - Tool interchangeability (multi-function stations save space) - Safety certifications (CE, ISO 13485 for medical applications) - Software integration (data logging for quality control) - Budget vs. long-term ROI (higher initial cost often reduces rework rates)

8. Industry Trends

Emerging developments include: - AI-powered thermal profiling for adaptive soldering - Miniaturization of hot-air nozzles for 01005 component handling - IoT-enabled stations with cloud-based process monitoring - Increased adoption of lead-free soldering systems (RoHS compliance) - Integration with automated optical inspection (AOI) systems