Soldering, Desoldering, Rework Stations

Image Part Number Description / PDF Quantity Rfq
AO853A++

AO853A++

SRA Soldering Products

853A++ PROGRAMMABLE QUARTZ PREHE

8

AO852A++

AO852A++

SRA Soldering Products

852A ++ SMD DIGITAL HOT AIR REWO

107

AO2702A+

AO2702A+

SRA Soldering Products

2702A+ ALL IN ONE DIGITAL HOT AI

16

AO866220V

AO866220V

SRA Soldering Products

866 ALL IN1 DIGITAL HOT AIR REWO

10

AO9378

AO9378

SRA Soldering Products

9378 PRO 60 WATT PROGRAMMABLE DI

62

AO888A220V

AO888A220V

SRA Soldering Products

888A 2 IN 1 DIGITAL HOT AIR REWO

0

AO9378-TWZKIT

AO9378-TWZKIT

SRA Soldering Products

AOYUE INT 9378 PRO WITH MACRO AN

0

AOSP2000+

AOSP2000+

SRA Soldering Products

LEAD FREE SOLDER POT SP2000+ WIT

16

AO2703A+

AO2703A+

SRA Soldering Products

2703A+ ALL IN ONE DIGITAL HOT AI

44

AO738H

AO738H

SRA Soldering Products

738H 5 IN 1 DIGITAL HOT AIR REWO

160

AOSP4000

AOSP4000

SRA Soldering Products

MINI SOLDER POT SP4000, 160 WATT

0

Soldering, Desoldering, Rework Stations

1. Overview

Soldering, desoldering, and rework stations are essential tools in electronics manufacturing and repair. These systems enable precise joining (soldering), removal (desoldering), and modification (rework) of electronic components on printed circuit boards (PCBs). With miniaturization of electronic devices and increasing complexity of surface-mount technology (SMT), these stations ensure high-quality connections while minimizing thermal damage to sensitive components. Their importance spans industries from consumer electronics to aerospace, where reliability and precision are critical.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Soldering Stations Temperature-controlled soldering irons, hot-air systems, and infrared heating PCB assembly, fine-pitch component soldering
Desoldering Stations Vacuum pumps for solder removal, temperature-sensitive desoldering tips Component replacement, PCB repair
Rework Stations Multi-functional platforms combining soldering/desoldering with precision control BGA/QFN package rework, prototype modifications

3. Structure and Components

Typical systems consist of: - Control Unit: Digital interface for temperature, airflow, and timing adjustments - Heating Element: Ceramic or carbon heating systems with rapid thermal response - Handpiece: Ergonomic design with interchangeable tips (soldering iron, hot-air nozzle) - Vacuum System: For desoldering applications (in integrated stations) - Temperature Sensors: Closed-loop feedback for 1 C accuracy

4. Key Technical Specifications

Parameter Description
Temperature Range 100-450 C (standard), extended ranges available for specialty applications
Thermal Recovery Ability to maintain set temperature under thermal load (critical for SMT)
Power Output 50-200W depending on application requirements
Nozzle Compatibility Interchangeable nozzles for different component sizes (0.3mm to 5mm)
ESD Safety Electrostatic discharge protection for sensitive electronics

5. Application Fields

- Consumer Electronics: Smartphone assembly (e.g., Apple iPhone motherboard repair) - Automotive: Engine control unit (ECU) manufacturing and repair - Medical Devices: Pacemaker PCB assembly requiring Class III IPC standards - Aerospace: Avionics systems with MIL-STD-2000A compliance - Prototyping: R&D labs for rapid circuit modifications

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Metcal SX800 Selectable Output Series SmartHeat technology with 256 temperature profiles
JBC CD 2B Plus Rework Station Modular design with instant heating cartridges
Aoyue 968A+ Soldering Station Advanced PID control, ESD-safe construction

7. Selection Recommendations

Consider: - Application type (precision SMT vs. heavy-duty repair) - Temperature stability requirements ( 2 C for BGA rework) - Tool interchangeability (multi-function stations save space) - Safety certifications (CE, ISO 13485 for medical applications) - Software integration (data logging for quality control) - Budget vs. long-term ROI (higher initial cost often reduces rework rates)

8. Industry Trends

Emerging developments include: - AI-powered thermal profiling for adaptive soldering - Miniaturization of hot-air nozzles for 01005 component handling - IoT-enabled stations with cloud-based process monitoring - Increased adoption of lead-free soldering systems (RoHS compliance) - Integration with automated optical inspection (AOI) systems

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