| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Chip Quik, Inc. |
QFN-20 0.5 MM PITCH 4.0 X 4.0 MM |
0 |
|
 |
Chip Quik, Inc. |
STENCIL BGA-484 1.27MM |
14 |
|
 |
Chip Quik, Inc. |
FPC/FFC SMT CONN STENCIL |
0 |
|
 |
Chip Quik, Inc. |
SOT-666 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
POWERSOIC-24/PSOP-24/HSOP-24 STE |
0 |
|
 |
Chip Quik, Inc. |
BGA-36 STAINLESS STEEL STENCIL |
9 |
|
 |
Chip Quik, Inc. |
DFN-10 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
SOIC-8 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
TQFP-60 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
MINI SOIC-10 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
QFN-32 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
QFN-44 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
DFN-10 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
LGA-28 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
MLP/DFN-6 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
STENCIL BGA-100 1.27MM |
0 |
|
 |
Chip Quik, Inc. |
LQFP-128 (0.5MM PITCH, 20X20MM B |
0 |
|
 |
Chip Quik, Inc. |
SSOP-56 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
LLP-60 STENCIL |
0 |
|
 |
Chip Quik, Inc. |
FPC/FFC SMT CONN STENCIL |
0 |
|
Solder stencils and templates are precision-engineered tools used to apply solder paste onto printed circuit boards (PCBs) during surface mount technology (SMT) assembly. They ensure accurate deposition of solder paste in predefined patterns, enabling reliable electrical connections for components. These tools are critical for achieving high-yield, high-quality electronic assemblies in modern electronics manufacturing, where miniaturization and component density demand extreme precision.
| Type | Functional Features | Application Examples |
|---|---|---|
| Laser-Cut Stencils | High-precision laser-cut apertures, stainless steel construction, nanocoating for solder release | Smartphones, wearable devices |
| Chemically Etched Templates | Cost-effective, double-sided etching for aperture definition | Automotive PCBs, industrial controls |
| Step Stencils | Variable thickness for different solder volumes on same board | High-density interconnect (HDI) boards |
| Polymer Templates | Flexible material for prototyping and low-volume production | Consumer electronics R&D |
Typical solder stencils consist of: - Frame: Aluminum or steel tensioning frame (25-50 m tension specification) - Foil: 304 stainless steel (thickness 0.08-0.25mm) or polymer materials - Aperture Design: CAD-optimized openings with tolerances 25 m - Coating: Electropolished or nano-coated surfaces for improved paste release - Alignment System: Precision fiducial markers and mounting hardware
| Parameter | Typical Values | Importance |
|---|---|---|
| Aperture Accuracy | 25 m (laser), 50 m (etching) | Determines solder volume precision |
| Thickness | 0.08-0.25mm | Controls solder paste volume |
| Surface Roughness | 0.1-0.5 m Ra | Affects paste release efficiency |
| Tension Uniformity | 25-40 Newtons | Ensures consistent printing pressure |
Primary industries include: - Consumer Electronics: Smartphone assembly lines (e.g., iPhone motherboard production) - Automotive: ECU manufacturing for Tesla vehicles - Medical Devices: Pacemaker PCB assembly - Industrial Equipment: CNC machine control boards - Telecommunications: 5G base station RF modules
| Manufacturer | Headquarters | Representative Product |
|---|---|---|
| DEK (Nordson) | UK | DEK Horizon stencil printer |
| Mycronic | Sweden | Mycro 1300 laser stencil |
| Speedprint Automation | Denmark | SP3000 automated stencil system |
| Shenzhen Sinotek | China | ST-6000L laser stencil |
Key considerations: 1. Material Selection: Stainless steel for volume production, polymer for prototypes 2. Thickness Requirements: Based on smallest component pitch (e.g., 0.4mm pitch requires 0.15mm thickness) 3. Aperture Design: Match to IPC-7527 standards for component types 4. Coating Type: Electropolished for lead-free solder, nano-coated for ultra-fine pitch 5. Cost vs Precision: Laser (high cost, high precision) vs etching (lower cost, moderate precision)
Current developments include: - Miniaturization: 0.3mm aperture capability for 01005 component packaging - Smart Integration: IoT-enabled stencils with embedded sensors - Eco-friendly Solutions: Lead-free compatible coatings and recyclable materials - 3D Printing: Additive manufacturing for complex aperture geometries - AI Optimization: Machine learning-driven aperture design for improved print quality