Solder Sponges, Tip Cleaners

Image Part Number Description / PDF Quantity Rfq
EA439-C

EA439-C

EDSYN Inc.

DRY SOLDERING TIP CLEANER

81

S2745-S-T

S2745-S-T

Tronex (Menda/EasyBraid/Tronex)

SOLDR SPONGE 4.5X2.7" SLITS 10PK

0

S2222-O-M

S2222-O-M

Tronex (Menda/EasyBraid/Tronex)

SLDR SPNG 2.2X2.2" CTR HOL 1000P

0

CS-BS1

CS-BS1

American Beauty Tools

BRASS SPONGE TIP CLEANER

10

CS-17/625

CS-17/625

Techspray

SOLDER SPONGE 17X8.5" PLAIN

52

CLMU-A

CLMU-A

JBC TOOLS USA INC.

UNIVERSAL TIP CLEANER

9

S3030R-O-T

S3030R-O-T

Tronex (Menda/EasyBraid/Tronex)

SLDR SPNG 3" DIA CNTR HOLE 10PK

7

3540

3540

Adafruit

SQUARE 60MM X 60MM SOLDERING SPO

0

TTKIT

TTKIT

SRA Soldering Products

SOLDERING TIP MAINTENANCE KIT

128

JA-50-B

JA-50-B

NTE Electronics, Inc.

REPLACEMENT BRASS BALL

4

S3444-S-T

S3444-S-T

Tronex (Menda/EasyBraid/Tronex)

SOLDR SPONGE 4.4X3.4" SLITS 10PK

0

T0052241999

T0052241999

Xcelite

SLDR SPNG 2.75X2.16" CTR HOL 5PK

252

TT-21G

TT-21G

SRA Soldering Products

LEAD FREE TIP TINNER, 21G CONTAI

68

EC205

EC205

Xcelite

SOLDER SPONGE 2.5X4.65" PLAIN

290

SMDTCLF

SMDTCLF

Chip Quik, Inc.

SOLDER TIP TINNER (ACTIVATOR)

1300

S3017-O-T

S3017-O-T

Tronex (Menda/EasyBraid/Tronex)

SLDR SPONGE 3X1.7" CTR HOLE

22

RS200

RS200

EDSYN Inc.

REPLACEMENT SPONGE-ROUND

38

TPC-14

TPC-14

CAIG Laboratories, Inc.

TIP TINNER AND CLEANER

21

SALAMMONIAC-100G

SALAMMONIAC-100G

SRA Soldering Products

SAL AMMONIAC BLOCK - 100 GRAMS

54

LT-1

LT-1

EDSYN Inc.

LEAD-FREE TIP TINNER/CLEANER

21

Solder Sponges, Tip Cleaners

1. Overview

Solder sponges and tip cleaners are essential consumables in soldering and rework processes. They maintain soldering iron tip cleanliness, ensure thermal conductivity, and prolong tool lifespan. Modern electronics manufacturing demands precise oxide removal and contamination control, making these products critical for high-reliability applications.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Standard Cellulose SpongesWater-absorbent, cost-effective, manual cleaningGeneral electronics assembly
Ceramic Fiber SpongesHigh-temperature resistant (up to 450 C), long-lastingAutomotive electronics production
Self-Cleaning Sponge SystemsIntegrated water circulation, automated cleaningSurface Mount Technology (SMT) lines
Brass Wool Tip CleanersMechanical oxide removal, chemical-free processMilitary/aerospace PCB assembly
Graphite-Coated Cleaning StationsStatic-dissipative, anti-corrosion propertiesMedical device manufacturing

3. Structure & Composition

Typical structures include:

  • Open-cell foam matrix (cellulose or synthetic polymers)
  • Reinforced fiber networks (ceramic or stainless steel)
  • Multi-layer composite designs with absorbent cores

Technical compositions vary from natural cellulose blends (60-70% water retention) to advanced ceramic-alumina composites with porous microstructures.

4. Key Technical Specifications

ParameterSignificanceTypical Values
Thermal ResistancePrevents thermal shock to soldering tips300-500 C operational range
Cleaning EfficiencyOxide removal rate per cleaning cycle 92% for premium ceramic types
Service LifeDurability under regular usage500-2000 cleaning cycles
Electrostatic Discharge (ESD) ProtectionPrevents component damage<10^9 ohms surface resistance
Chemical ResistanceCompatibility with flux residuesResists >30 common soldering chemicals

5. Application Fields

Primary industries:

  • Consumer electronics (smartphones, wearables)
  • Automotive electronics (ECUs, sensors)
  • Aerospace/defense (avionics, guidance systems)
  • Medical devices (implantables, diagnostic equipment)

Typical equipment: JUKI FX-3 , Siemens SIPLACE , Hakko FX-951

6. Leading Manufacturers & Products

ManufacturerKey ProductsTechnical Highlights
ElectrolSuper Sponge PlusPatented hydro-cell technology, 400 C
HakkoFS-100 Cleaning StationThree-stage cleaning system with ESD protection
MetcalST-120 Smart SpongeIntegrated moisture sensor and auto-refill
OK International928-X Cleaning ModuleModular design for automated lines

7. Selection Guidelines

Key considerations:

  • Soldering process type (wave, reflow, manual)
  • Tip geometry compatibility
  • Operating temperature requirements
  • ESD sensitivity of environment
  • Maintenance cost analysis (lifetime vs. replacement frequency)

Case study: Automotive manufacturer reduced tip replacement by 40% switching to ceramic fiber sponges.

8. Industry Trends

Emerging developments:

  • Nano-coated surfaces for self-cleaning properties
  • IoT-enabled smart cleaning stations with usage analytics
  • Biodegradable composite materials (ASTM D5511 certified)
  • Laser-activated cleaning systems for precision applications

Market growth projections indicate 7.2% CAGR through 2027, driven by miniaturization demands in 5G and IoT devices.

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