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Desoldering Braid, Wick, Pumps

Image Part Number Description / PDF Quantity Rfq
485-8C

485-8C

American Beauty Tools

DESOLDERING BRAID DISPENSER

10
5-100L

5-100L

ITW Chemtronics (Chemtronics)

DESOLDER BRAID ROSIN 0.05" 100'

22
SW01-25

SW01-25

NTE Electronics, Inc.

NC WICK #3 GREEN 25FT

11
TLXURON4015-3

TLXURON4015-3

SRA Soldering Products

W4015-3 -REPLACEMENT CASSETTE FO

26
S-A-5AS

S-A-5AS

Tronex (Menda/EasyBraid/Tronex)

DESOLDER BRAID UNFLUXD 0.025" 5'

53
AS196

AS196

EDSYN Inc.

SILVERSTAT SOLDAPULLT DESOLDER T

18
1804-100F

1804-100F

Techspray

DESOLDER BRAID ROSIN 0.098" 100'

13
DS017LS

DS017LS

EDSYN Inc.

ESD-SAFE SOLDAPULLT DESOLDER TOO

55
1815-5F

1815-5F

Techspray

DESOLDER BRAID NO-CLN 0.055" 5'

58
SW14035

SW14035

ITW Chemtronics (Chemtronics)

DESOLDR BRAID LEAD FREE 0.08" 5'

0
S-B-100

S-B-100

Tronex (Menda/EasyBraid/Tronex)

DESOLDER BRAID UNFLUX 0.05" 100'

19
DP-140

DP-140

OK Industries (Jonard Tools)

DESOLDER PUMP WITH TIP LEAD FREE

45
454

454

MG Chemicals

DESOLDER BRAID ROSIN 0.1" 50'

79
1803-10F

1803-10F

Techspray

DESOLDER BRAID ROSIN 0.075" 10'

41
S-D-10AS

S-D-10AS

Tronex (Menda/EasyBraid/Tronex)

DESOLDER BRAID UNFLUXED 0.1" 10'

31
Q-B-10AS

Q-B-10AS

Tronex (Menda/EasyBraid/Tronex)

DESOLDER BRAID ROSIN 0.05" 10'

96
SS750LS

SS750LS

EDSYN Inc.

ECONOMICAL ESD-SAFE SOLDAPULLT

43
452

452

MG Chemicals

DESOLDER BRAID ROSIN 0.05" 50'

4
LF-B-5AS

LF-B-5AS

Tronex (Menda/EasyBraid/Tronex)

DESOLDER BRAID ROSIN 0.05" 5'

24
148

148

Adafruit

SOLDER SUCKER

0

Desoldering Braid, Wick, Pumps

1. Overview

Desoldering products are essential tools for removing solder from electronic assemblies during manufacturing, repair, and rework processes. These tools include desoldering braids (wick), manual and electric desoldering pumps, and specialized equipment. With the miniaturization of electronic components and the rise of lead-free soldering requirements, precision desoldering solutions have become critical in maintaining product reliability and reducing rework costs.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Copper Braid (Wick)Capillary action absorbs molten solder; available in multiple widths and flux typesPCB trace repair, SMD component removal
Manual Desoldering PumpSpring-loaded piston creates vacuum; ergonomic designs for repetitive tasksThrough-hole component replacement, prototype development
Electric Desoldering StationTemperature-controlled pump with vacuum system; includes solder recoveryBGA rework, high-density PCB repair
Desoldering Wick with FluxIntegrated rosin flux for oxidation prevention; self-activating during heatingHigh-reliability military/aerospace applications

3. Structure and Composition

Desoldering braids consist of oxygen-free copper woven into braided structures with optional rosin-based flux coatings. Manual pumps typically feature stainless steel pistons, silicone seals, and anti-static plastic housings. Electric systems incorporate ceramic heating elements (300-450 C range), adjustable vacuum motors, and ESD-safe materials. Advanced models include temperature sensors and automatic shut-off mechanisms.

4. Key Technical Specifications

ParameterDescriptionImportance
Suction Rate30-100 ml/sec for manual pumps; 200-500 ml/sec for electric systemsDetermines removal efficiency and residue prevention
Temperature Range300-450 C (adjustable in 5 C increments)Matches various solder alloys (SnPb, SAC305, etc.)
Material CompatibilityCopper braid purity >99.9%, RoHS-compliant plasticsAffects solder wetting and contamination risk
ESD ProtectionResistance <10^9 for conductive componentsPrevents damage to sensitive semiconductors
Vacuum Pressure15-25 inHg for electric pumpsEnsures complete solder extraction from vias

5. Application Fields

  • Consumer Electronics: Smartphone motherboard repairs
  • Automotive: ECU module rework (e.g., Infineon chip replacement)
  • Aerospace: MIL-STD-2000A compliant PCB assembly
  • Medical Devices: Class III equipment component replacement
  • Education: STEM lab prototyping and error correction

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
Electro-SolveChemtronics Desoldering KitUltra-soft copper braid with water-soluble flux
OK InternationalESD1310 Desoldering StationDigital temperature control 2 C accuracy
HakkoFR-300 Electric PumpPID temperature regulation, 400 C in 15 seconds
3MSCD-1500 Solder WickHalogen-free flux formulation for RoHS compliance

7. Selection Guidelines

Consider these factors: solder alloy type (lead-free requires higher temperatures), component density (fine-pitch requires sub-1mm wick), production volume (high-volume needs automated systems), ESD sensitivity (critical for CMOS devices), and operator skill level. For BGA rework, select systems with thermal profiling capabilities and vacuum-assisted extraction.

8. Industry Trends

Key developments include: integration of IoT-enabled temperature monitoring, biodegradable flux formulations, AI-powered desoldering robots for precision manufacturing, and micro-vacuum systems for 0.3mm pitch components. The shift to lead-free solders (SAC alloys) drives demand for high-temperature resistant materials (up to 480 C). Market research indicates 7.2% CAGR through 2027, with Asia-Pacific as the fastest-growing region.

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