Desoldering Braid, Wick, Pumps

Part Number	Description / PDF	Quantity
1803-500F Techspray	DESOLDER BRAID ROSIN 0.075" 500'	0
TLXURON1000-3 SRA Soldering Products	XURON 1000-3 -DESOLDERING BRAID	10
7880 Xcelite	DESOLDER PUMP WITH TIP	0
5-500L ITW Chemtronics (Chemtronics)	DESOLDER BRAID ROSIN 0.05" 500'	0
80-3-5 ITW Chemtronics (Chemtronics)	DESOLDER BRAID ROSIN 0.08" 5'	101
1823-25F Techspray	DESOLDER BRAID NO-CLN 0.098" 25'	27
1808-100F Techspray	DESOLDER BRAID ROSIN 0.035" 100'	7
60-1-10 ITW Chemtronics (Chemtronics)	DESOLDER BRAID NO-CLN 0.03" 10'	108
1822-100F Techspray	DESOLDR BRAID NO-CLN 0.075" 100'	3
442 MG Chemicals	DESOLDER BRAID ROSIN 0.05" 25'	27
60-4-5 ITW Chemtronics (Chemtronics)	DESOLDER BRAID NO-CLN 0.11" 5'	62
60-4-10 ITW Chemtronics (Chemtronics)	DESOLDER BRAID NO-CLN 0.11" 10'	42
424 MG Chemicals	DESOLDER BRAID ROSIN 0.05" 5'	185
404030001 Seeed	DESOLDER BRAID 0.118" 5'	0
SW04-50 NTE Electronics, Inc.	NC WICK ANTI-STAT #4 50FT	10
1832-5F Techspray	DESOLDER BRAID UNFLUXD 0.075" 5'	61
Q-A-25 Tronex (Menda/EasyBraid/Tronex)	DESOLDER BRAID ROSIN 0.025" 25'	30
1809-5F Techspray	DESOLDER BRAID ROSIN 0.055" 5'	89
SS350 EDSYN Inc.	ESD-SAFE SOLDAPULLT CHALLENGER	42
1810-25F Techspray	DESOLDER BRAID ROSIN 0.075" 25'	15

Desoldering Braid, Wick, Pumps

1. Overview

Desoldering products are essential tools for removing solder from electronic assemblies during manufacturing, repair, and rework processes. These tools include desoldering braids (wick), manual and electric desoldering pumps, and specialized equipment. With the miniaturization of electronic components and the rise of lead-free soldering requirements, precision desoldering solutions have become critical in maintaining product reliability and reducing rework costs.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Copper Braid (Wick)	Capillary action absorbs molten solder; available in multiple widths and flux types	PCB trace repair, SMD component removal
Manual Desoldering Pump	Spring-loaded piston creates vacuum; ergonomic designs for repetitive tasks	Through-hole component replacement, prototype development
Electric Desoldering Station	Temperature-controlled pump with vacuum system; includes solder recovery	BGA rework, high-density PCB repair
Desoldering Wick with Flux	Integrated rosin flux for oxidation prevention; self-activating during heating	High-reliability military/aerospace applications

3. Structure and Composition

Desoldering braids consist of oxygen-free copper woven into braided structures with optional rosin-based flux coatings. Manual pumps typically feature stainless steel pistons, silicone seals, and anti-static plastic housings. Electric systems incorporate ceramic heating elements (300-450 C range), adjustable vacuum motors, and ESD-safe materials. Advanced models include temperature sensors and automatic shut-off mechanisms.

4. Key Technical Specifications

Parameter	Description	Importance
Suction Rate	30-100 ml/sec for manual pumps; 200-500 ml/sec for electric systems	Determines removal efficiency and residue prevention
Temperature Range	300-450 C (adjustable in 5 C increments)	Matches various solder alloys (SnPb, SAC305, etc.)
Material Compatibility	Copper braid purity >99.9%, RoHS-compliant plastics	Affects solder wetting and contamination risk
ESD Protection	Resistance <10^9 for conductive components	Prevents damage to sensitive semiconductors
Vacuum Pressure	15-25 inHg for electric pumps	Ensures complete solder extraction from vias

5. Application Fields

Consumer Electronics: Smartphone motherboard repairs
Automotive: ECU module rework (e.g., Infineon chip replacement)
Aerospace: MIL-STD-2000A compliant PCB assembly
Medical Devices: Class III equipment component replacement
Education: STEM lab prototyping and error correction

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Electro-Solve	Chemtronics Desoldering Kit	Ultra-soft copper braid with water-soluble flux
OK International	ESD1310 Desoldering Station	Digital temperature control 2 C accuracy
Hakko	FR-300 Electric Pump	PID temperature regulation, 400 C in 15 seconds
3M	SCD-1500 Solder Wick	Halogen-free flux formulation for RoHS compliance

7. Selection Guidelines

Consider these factors: solder alloy type (lead-free requires higher temperatures), component density (fine-pitch requires sub-1mm wick), production volume (high-volume needs automated systems), ESD sensitivity (critical for CMOS devices), and operator skill level. For BGA rework, select systems with thermal profiling capabilities and vacuum-assisted extraction.

8. Industry Trends

Key developments include: integration of IoT-enabled temperature monitoring, biodegradable flux formulations, AI-powered desoldering robots for precision manufacturing, and micro-vacuum systems for 0.3mm pitch components. The shift to lead-free solders (SAC alloys) drives demand for high-temperature resistant materials (up to 480 C). Market research indicates 7.2% CAGR through 2027, with Asia-Pacific as the fastest-growing region.