Accessories

Image Part Number Description / PDF Quantity Rfq
MCC-101TEA

MCC-101TEA

MicroCare

MPM ECONOMY PAPER STENCIL WIPER

90

MCC-101DA

MCC-101DA

MicroCare

MPM FINE PITCH PAPER STENCIL WIP

98

MCC-101TX

MCC-101TX

MicroCare

MPM SUPERSAVER STENCIL WIPER

100

MCC-W66

MCC-W66

MicroCare

POLYESTER / CELLULOSE ECONOMY WI

74

MCC-W66DF

MCC-W66DF

MicroCare

SYNTHETIC POLYMER REWORK WIPES -

18

MCC-105DA

MCC-105DA

MicroCare

DEK MICRO-WIPE FINE PITCH STENCI

100

MCC-W99DF

MCC-W99DF

MicroCare

SYNTHETIC POLYMER REWORK WIPES -

26

MCC-W11

MCC-W11

MicroCare

POLYESTER / CELLULOSE LOW LINT S

10

MCC-W99

MCC-W99

MicroCare

LINT FREE ECONOMY JUMBO DRY WIPE

71

MCC-W12

MCC-W12

MicroCare

POLYESTER / CELLULOSE JUMBO SIZE

29

MCC-105EA

MCC-105EA

MicroCare

DEK ECONOMY PAPER STENCIL WIPER

100

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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