Accessories

Image Part Number Description / PDF Quantity Rfq
RCS71

RCS71

EDSYN Inc.

RETAINING SLEEVE AND COLLAR FOR

50

VA175

VA175

EDSYN Inc.

SOLDAVAC AIR & VACUUM PICK-UP SY

2

RS372

RS372

EDSYN Inc.

RETAINING SLEEVE FOR STANDARD TI

100

WP812

WP812

EDSYN Inc.

HIGH TEMPERATURE WORK PAD

9

XF2502

XF2502

EDSYN Inc.

COMBINED HEPA FILTER FOR FX225 &

5

XF2503

XF2503

EDSYN Inc.

GAS FILTER FOR FX225 & FX300

5

LP20

LP20

EDSYN Inc.

COMPACT PORTABLE VACUUM TOOL

50

PT109MK

PT109MK

EDSYN Inc.

MAINTENANCE KIT FOR THE PT109

5

XF2501

XF2501

EDSYN Inc.

PRE-FILTER FOR FX225 & FX300 (5P

2

XF01

XF01

EDSYN Inc.

FUMINATOR FILTER SET W/ 1 EA XF0

80

DS017MK

DS017MK

EDSYN Inc.

MAINTENANCE KIT FOR THE DS017

47

US340MK

US340MK

EDSYN Inc.

MAINTENANCE KIT FOR THE US40

5

XF300

XF300

EDSYN Inc.

PRE-FILTER & FOAM FILTER FOR FX3

5

AS196MK

AS196MK

EDSYN Inc.

MAINTENANCE KIT FOR THE AS196

45

SS750LSMK

SS750LSMK

EDSYN Inc.

MAINTENANCE KIT FOR THE SS750LS

5

XF02

XF02

EDSYN Inc.

FUMINATOR PRIMARY FILTER (SET OF

90

RS271

RS271

EDSYN Inc.

RETAINING SLEEVE FOR HEAVY DUTY

5

SR060

SR060

EDSYN Inc.

HOLLOW HEATER ASSEMBLY KIT 120V

10

SS350MK

SS350MK

EDSYN Inc.

MAINTENANCE KIT FOR THE SS350

2

US140MK

US140MK

EDSYN Inc.

MAINTENANCE KIT FOR THE US140

5

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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