Accessories

Image Part Number Description / PDF Quantity Rfq
B2874

B2874

Hakko

CLEANING PIN, 0.6MM

16

80-35

80-35

Master Appliance Corp.

WRENCH, EJECTOR SPANNER

0

10519

10519

American Beauty Tools

FOOTSWITCH

10

T0058741822N

T0058741822N

Xcelite

HEATING ELEMENT DXV 80

0

70-01-14

70-01-14

Master Appliance Corp.

ADAPTER 8.4 (4MM DIAMETER X .7M

0

0CA10-1001

0CA10-1001

Kurtz Ersa, Inc.

COMBINED FILTER

1

T0058735895N

T0058735895N

Xcelite

FUME EXTRACTOR CTN FILTR WFE2S/2

0

202274EB

202274EB

EMIT

PRE-FILTER - LABYRINTH F8/F9 ALP

21

HE25

HE25

Xcelite

HEATER 25W FOR WP25 IRON

1

7883

7883

Xcelite

TIP FOR 7881 DESOLDER PUMP

0

670001

670001

EMIT

REBALLING KIT, W/ NORTH AMERICA

0

110531EB

110531EB

EMIT

MAIN FILTER - HEPA CHEMICAL

0

1237SBK

1237SBK

Xcelite

HEATER FOR THREAD-ON TIPS 33W

0

100181EB

100181EB

EMIT

CAPTURE KIT FOR FUMEBUSTER, CONI

0

MINISQUEEGE-1

MINISQUEEGE-1

Chip Quik, Inc.

SQUEEGEE FOR STENCIL

350

200275EB

200275EB

EMIT

PRE-FILTER, PAD, 800I (4/PACK)

0

72-01-54

72-01-54

Master Appliance Corp.

ATTACHMENT, HEAT SHRINK, 1-1/4"

0

T0051360399N

T0051360399N

Xcelite

GASKETS GLASS TUBE (10)

0

100295EB

100295EB

EMIT

38MM S/S FLEX ARM KIT CLAMP FIX

0

SC-PCSA

SC-PCSA

Ideal-tek

FRAME HOLDER FOR PCSA-1 AND PCSA

10

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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