Accessories

Image Part Number Description / PDF Quantity Rfq
C1390C

C1390C

Hakko

OMNIVISE,1PC

38

72-52U

72-52U

Master Appliance Corp.

CARRYING STRAP

0

421A-500ML

421A-500ML

MG Chemicals

LIQUID TIN

18

REM16-NL

REM16-NL

Chip Quik, Inc.

SMD / SMT CHIP REMOVAL ALLOY LF

10

PCSA-1.2

PCSA-1.2

Ideal-tek

REPLACEMENT FOAM FOR PCSA-1 ESD

5

T0053641400

T0053641400

Xcelite

SUCTION HOSE NB44 W/O END CAP

0

MCC-105DA

MCC-105DA

MicroCare

DEK MICRO-WIPE FINE PITCH STENCI

100

V8910

V8910

Chip Quik, Inc.

TOOL VACUUM PICK & PLACE W/TIPS

85

KDS510S6N

KDS510S6N

Xcelite

ADAPTER 10CC

28

UVO0000930

UVO0000930

Ideal-tek

45 NEEDLE ESD 9 MM CUP

0

EC234

EC234

Xcelite

HEATER ASSY FOR A EC1201T IRON

57

EC234FE

EC234FE

Xcelite

HEATING ELEMENT

0

FX780-01

FX780-01

Hakko

N2 STATION,GENERATOR,FX-780

0

KDS803S6N

KDS803S6N

Xcelite

ADAPTER 3CC

0

KDS806V

KDS806V

Xcelite

FOOT VALVE W/VACUUM

0

RS271

RS271

EDSYN Inc.

RETAINING SLEEVE FOR HEAVY DUTY

5

9358

9358

Xcelite

CERAMIC HEATER 800 DEG F

0

4083

4083

Xcelite

FILTER FOR DSV80 PACK OF 10 PCS

2

A1585

A1585

Hakko

FILTER,PRE,10PK,FA-430/HJ3100

367

100170EB

100170EB

EMIT

CONNECTION KIT 32-80MM X 1.5M

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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