Temperature Sensors - Thermostats - Solid State

Image Part Number Description / PDF Quantity Rfq
MAX6519UKP105+

MAX6519UKP105+

Analog Devices, Inc.

MAX6519 2.7V TO 5.5V, ANALOG TEM

9826

AD22105AR

AD22105AR

Analog Devices, Inc.

LOW VOLTAGE, RESISTOR PROGRAMMAB

301

MAX6519UKP105+T

MAX6519UKP105+T

Analog Devices, Inc.

MAX6519 2.7V TO 5.5V, ANALOG TEM

35000

LTC2996HDD#TRPBF

LTC2996HDD#TRPBF

Analog Devices, Inc.

THERMOSTAT 20/70DEG OPN DR 10DFN

0

ADT6501SRJZP105-RL

ADT6501SRJZP105-RL

Analog Devices, Inc.

THERMOSTAT 105DEG ACT LO SOT23-5

0

TMP01ES

TMP01ES

Analog Devices, Inc.

THERMOSTAT PROG ACT HIGH 8SOIC

0

Temperature Sensors - Thermostats - Solid State

1. Overview

Solid state temperature sensors and thermostats are electronic devices that detect and regulate temperature using semiconductor-based sensing elements. Unlike mechanical thermostats, these solid state devices offer faster response times, higher precision, and enhanced reliability through electronic signal processing. They play critical roles in industrial automation, consumer electronics, automotive systems, and medical equipment by enabling precise thermal management and energy-efficient operations.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Semiconductor-based SensorsUtilize silicon bandgap technology for linear output, high accuracy ( 0.5 C typical)Computer CPU thermal protection
Thermistor Interface ICsDigital output with integrated ADC, supports I2C/SPI protocolsSmart home thermostats
Thermal SwitchesProgrammable trip points, latching/non-latching modesIndustrial oven controllers
MEMS Thermal SensorsMicromachined structures for miniaturized applicationsWearable health monitors

3. Structure and Components

Typical solid state devices consist of: (1) Semiconductor sensing element (silicon/germanium), (2) Signal conditioning circuitry (amplifiers, ADCs), (3) Protective packaging (epoxy/ ceramic encapsulation), (4) Interface connectors (wire leads/SMD pads). Advanced designs integrate microcontroller units for smart functionality, with temperature-to-digital conversion performed on-chip.

4. Key Technical Specifications

ParameterImportance
Temperature Range (-55 C to +150 C)Determines operational environment suitability
Accuracy ( 0.1 C to 3 C)Critical for precision applications like medical devices
Response Time (1ms-10s)Affects system reaction speed
Output Type (Analog Voltage/PWM/Digital)Dictates compatibility with control systems
Power Consumption (5 A-10mA)Essential for battery-powered devices
Thermal Hysteresis (0.1 C-5 C)Prevents oscillation in switching applications

5. Application Fields

Key industries include: Industrial Process Control (chemical reactors), Medical Equipment (patient monitors), Automotive (battery management systems), Consumer Electronics (smartphones), HVAC systems, and Aerospace (avionics thermal regulation). Specific devices: semiconductor manufacturing tools, electric vehicle battery packs, and refrigeration systems.

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Texas InstrumentsLM75BDigital temperature sensor with 1 C accuracy
STMicroelectronicsL6281Thermal protector for motor drives
HoneywellTSY01-B1Digital thermostat IC for HVAC
Omron ElectronicsD6T-44LMEMS-based thermal array sensor

7. Selection Guidelines

Key considerations: (1) Match temperature range to application environment, (2) Balance accuracy requirements with cost, (3) Verify packaging suitability (IP rating for harsh environments), (4) Check interface compatibility (analog/digital), (5) Evaluate power budget constraints, (6) Consider calibration requirements. For industrial applications, prioritize long-term stability; for consumer devices, focus on size and cost.

8. Industry Trends

Current trends include: Development of wireless temperature nodes for IoT applications, integration with AI-based predictive maintenance systems, advancement of ultra-low-power wake-up sensors (<1 A consumption), adoption of wide bandgap semiconductors for high-temperature operation, and increased use of MEMS technology for flexible form factors. Market growth driven by electric vehicle thermal management and smart building automation demands.

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