| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACT HI/LOW 8SOIC |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACTIVE HIGH 8DIP |
233 |
|
 |
Maxim Integrated |
THERMOSTAT 5DEGC ACT HI SOT23-5 |
372495 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 95DEGC ACT LO SOT23-5 |
100 |
|
 |
ROHM Semiconductor |
THERMOSTAT 60DEGC ACT LOW HVSOF5 |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN HSNT4-B |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN SNT4A |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN SNT4A |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN HSNT4-B |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACTIVE HIGH 8DIP |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT PROG ACTIVE HIGH 8DIP |
0 |
|
 |
Texas Instruments |
THERMOSTAT 110DEG ACT LO SOT23-5 |
4211 |
|
 |
Maxim Integrated |
THERMOSTAT PRG ACT HI/LO SOT23-6 |
7099 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT OPEN DRAIN SNT4A |
0 |
|
 |
MEMORY IC(EEPROM) |
0 |
|
|
 |
Texas Instruments |
THERMOSTAT PROG ACT HI/LO 8TSSOP |
0 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 75DEGC ACT LO HSNT4-B |
10047 |
|
 |
ABLIC U.S.A. Inc. |
THERMOSTAT 45DEGC ACT LOW SNT-6A |
100 |
|
 |
Texas Instruments |
THERMOSTAT 60DEG ACT HI SOT563-6 |
0 |
|
 |
Roving Networks / Microchip Technology |
THERMOSTAT 25/35DEG ACT LO 8MSOP |
0 |
|
Solid state temperature sensors and thermostats are electronic devices that detect and regulate temperature using semiconductor-based sensing elements. Unlike mechanical thermostats, these solid state devices offer faster response times, higher precision, and enhanced reliability through electronic signal processing. They play critical roles in industrial automation, consumer electronics, automotive systems, and medical equipment by enabling precise thermal management and energy-efficient operations.
| Type | Functional Features | Application Examples |
|---|---|---|
| Semiconductor-based Sensors | Utilize silicon bandgap technology for linear output, high accuracy ( 0.5 C typical) | Computer CPU thermal protection |
| Thermistor Interface ICs | Digital output with integrated ADC, supports I2C/SPI protocols | Smart home thermostats |
| Thermal Switches | Programmable trip points, latching/non-latching modes | Industrial oven controllers |
| MEMS Thermal Sensors | Micromachined structures for miniaturized applications | Wearable health monitors |
Typical solid state devices consist of: (1) Semiconductor sensing element (silicon/germanium), (2) Signal conditioning circuitry (amplifiers, ADCs), (3) Protective packaging (epoxy/ ceramic encapsulation), (4) Interface connectors (wire leads/SMD pads). Advanced designs integrate microcontroller units for smart functionality, with temperature-to-digital conversion performed on-chip.
| Parameter | Importance |
|---|---|
| Temperature Range (-55 C to +150 C) | Determines operational environment suitability |
| Accuracy ( 0.1 C to 3 C) | Critical for precision applications like medical devices |
| Response Time (1ms-10s) | Affects system reaction speed |
| Output Type (Analog Voltage/PWM/Digital) | Dictates compatibility with control systems |
| Power Consumption (5 A-10mA) | Essential for battery-powered devices |
| Thermal Hysteresis (0.1 C-5 C) | Prevents oscillation in switching applications |
Key industries include: Industrial Process Control (chemical reactors), Medical Equipment (patient monitors), Automotive (battery management systems), Consumer Electronics (smartphones), HVAC systems, and Aerospace (avionics thermal regulation). Specific devices: semiconductor manufacturing tools, electric vehicle battery packs, and refrigeration systems.
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Texas Instruments | LM75B | Digital temperature sensor with 1 C accuracy |
| STMicroelectronics | L6281 | Thermal protector for motor drives |
| Honeywell | TSY01-B1 | Digital thermostat IC for HVAC |
| Omron Electronics | D6T-44L | MEMS-based thermal array sensor |
Key considerations: (1) Match temperature range to application environment, (2) Balance accuracy requirements with cost, (3) Verify packaging suitability (IP rating for harsh environments), (4) Check interface compatibility (analog/digital), (5) Evaluate power budget constraints, (6) Consider calibration requirements. For industrial applications, prioritize long-term stability; for consumer devices, focus on size and cost.
Current trends include: Development of wireless temperature nodes for IoT applications, integration with AI-based predictive maintenance systems, advancement of ultra-low-power wake-up sensors (<1 A consumption), adoption of wide bandgap semiconductors for high-temperature operation, and increased use of MEMS technology for flexible form factors. Market growth driven by electric vehicle thermal management and smart building automation demands.