| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
SpotSee |
30 MINICLIP: DOUBLE TUBE |
300 |
|
 |
SpotSee |
30 SHOCKWATCH TUBE - 100G |
1000 |
|
 |
SpotSee |
75 CLIP: SINGLE TUBE - CX75* |
300 |
|
 |
SpotSee |
FLEX 65: SINGLE TUBE |
0 |
|
 |
SpotSee |
75 SHOCKWATCH TUBE - 15G* |
1000 |
|
 |
SpotSee |
85 CLIP: SINGLE TUBE - CX85* |
300 |
|
 |
SpotSee |
35 CLIP: DOUBLE TUBE - CXX35 |
300 |
|
 |
SpotSee |
35 MINICLIP: SINGLE TUBE |
300 |
|
 |
SpotSee |
35 MINICLIP: DOUBLE TUBE |
300 |
|
Shock sensors are transducers designed to detect and measure sudden acceleration or deceleration forces caused by impacts, vibrations, or mechanical shocks. These devices convert mechanical energy into electrical signals for analysis, enabling system protection, data logging, or triggering control actions. As critical components in condition monitoring and safety systems, shock sensors play vital roles in automotive, aerospace, industrial automation, and consumer electronics sectors.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Mechanical Switch Sensors | Simple on/off contact activation at threshold acceleration | Package tamper detection, vehicle airbag deployment |
| MEMS Capacitive Sensors | Micromachined structures with capacitive detection, digital output | Smartphone orientation, HDD protection, industrial IoT |
| Strain Gauge Sensors | Resistive elements measuring mechanical deformation | Structural health monitoring, vehicle crash testing |
| Piezoelectric Sensors | Crystal elements generating voltage under mechanical stress | High-frequency vibration analysis, weapon system monitoring |
| Magnetic Sensors | Electromagnetic induction for shock detection | Railway vibration monitoring, seismic activity detection |
Typical shock sensor construction includes: 1) Sensing element (MEMS structure, piezoelectric crystal, or strain gauge), 2) Signal conditioning circuitry (amplifiers, filters), 3) Housing (metallic or polymer enclosure for environmental protection), 4) Electrical interface (wired connectors or wireless transceivers). High-performance variants incorporate hermetic sealing for extreme environments and integrated microcontrollers for signal processing.
| Parameter | Description | Importance |
|---|---|---|
| Measurement Range | Maximum/minimum detectable acceleration ( 2g to 5000g) | Determines sensor suitability for specific shock severity |
| Frequency Response | Operating bandwidth (0.5Hz-10kHz typical) | Affects transient event capture accuracy |
| Resolution | Minimum detectable change (0.01g-0.1g) | Impacts measurement precision |
| Shock Survival Rating | Maximum non-destructive input level | Ensures device durability in extreme conditions |
| Operating Temperature | Functional range (-55 C to +125 C) | Environmental reliability indicator |
| Output Type | Analog voltage/digital (I2C, SPI, CAN) | System integration compatibility |
Primary industries include: Automotive (airbag triggering, crash diagnostics), Industrial (machinery condition monitoring, pipeline integrity), Consumer Electronics (mobile device drop detection), Aerospace (flight recorder activation), Security (asset tracking, tamper alarms), Medical (implantable device monitoring). Typical equipment: Automotive crash test dummies, structural health monitoring systems, package tracking devices.
| Manufacturer | Product Series | Key Features |
|---|---|---|
| Analog Devices | ADXL375 | 3-axis MEMS, 2000Hz bandwidth, automotive qualified |
| TE Connectivity | EPIC Series | Hermetic sealing, 5000g range, MIL-STD-810G |
| PCB Piezotronics | 356A15 | Piezoelectric, 10kHz response, -55 C to +160 C |
| STMicroelectronics | LSM6DSOX | MEMS with AI edge processing, 6.5kHz ODR |
| Kistler Group | 8692C | High-precision charge output, 0.1-10000Hz |
Key considerations: 1) Required measurement range vs. expected shock levels, 2) Environmental conditions (temperature, humidity), 3) Frequency response matching application dynamics, 4) Output compatibility with existing systems, 5) Mounting constraints (PCB footprint, weight), 6) Calibration traceability (ISO 17025 requirements), 7) Cost vs. performance trade-offs. For example, MEMS sensors suit low-g consumer applications while piezoelectric types handle high-frequency industrial shocks.
Current developments focus on: Miniaturization via advanced MEMS fabrication, Wireless sensor integration with BLE/LoRa protocols, Edge AI processing for anomaly detection, Improved temperature stability through material innovation, Multi-axis sensing in compact packages, Enhanced durability for harsh environments (IP68+, radiation resistance). Market growth driven by automotive safety regulations (ISO 26262) and predictive maintenance adoption across industries.