Shock Sensors

Image Part Number Description / PDF Quantity Rfq
85MC/10G

85MC/10G

SpotSee

85 MINICLIP: SINGLE TUBE*

300

85MCD/10G

85MCD/10G

SpotSee

85 MINICLIP: DOUBLE TUBE*

300

33055

33055

SpotSee

FLEX 55: SINGLE TUBE

100

30MCD/100G

30MCD/100G

SpotSee

30 MINICLIP: DOUBLE TUBE

300

22404

22404

SpotSee

30 SHOCKWATCH TUBE - 100G

1000

32500

32500

SpotSee

75 CLIP: SINGLE TUBE - CX75*

300

33065

33065

SpotSee

FLEX 65: SINGLE TUBE

0

22409

22409

SpotSee

75 SHOCKWATCH TUBE - 15G*

1000

32600

32600

SpotSee

85 CLIP: SINGLE TUBE - CX85*

300

32801

32801

SpotSee

35 CLIP: DOUBLE TUBE - CXX35

300

35MC/75G

35MC/75G

SpotSee

35 MINICLIP: SINGLE TUBE

300

35MCD/75

35MCD/75

SpotSee

35 MINICLIP: DOUBLE TUBE

300

PKGS-00LDP1-R

PKGS-00LDP1-R

TOKO / Murata

SENSOR SHOCK 50G PIEZO FILM

0

HSS-10G-50W-N

HSS-10G-50W-N

Wickmann / Littelfuse

SENSOR SHOCK

0

PSLE382E-R44

PSLE382E-R44

KYOCERA Corporation

SENSOR SHOCK 25G PIEZO FILM

0

PSCE242K-R090C

PSCE242K-R090C

Elco (AVX)

SENSOR SHOCK 25G PIEZO FILM

0

EFJ-G25EF01

EFJ-G25EF01

Panasonic

SENSOR SHOCK 1500G PIEZO FILM

0

HSS-10G-10W-N

HSS-10G-10W-N

Wickmann / Littelfuse

SENSOR SHOCK PIEZO FILM

0

HSS-2G0-50W-N

HSS-2G0-50W-N

Wickmann / Littelfuse

SENSOR SHOCK

0

HSS-5G0-10W-N

HSS-5G0-10W-N

Wickmann / Littelfuse

SENSOR SHOCK

0

Shock Sensors

1. Overview

Shock sensors are transducers designed to detect and measure sudden acceleration or deceleration forces caused by impacts, vibrations, or mechanical shocks. These devices convert mechanical energy into electrical signals for analysis, enabling system protection, data logging, or triggering control actions. As critical components in condition monitoring and safety systems, shock sensors play vital roles in automotive, aerospace, industrial automation, and consumer electronics sectors.

2. Main Types & Functional Classification

TypeFunctional CharacteristicsApplication Examples
Mechanical Switch SensorsSimple on/off contact activation at threshold accelerationPackage tamper detection, vehicle airbag deployment
MEMS Capacitive SensorsMicromachined structures with capacitive detection, digital outputSmartphone orientation, HDD protection, industrial IoT
Strain Gauge SensorsResistive elements measuring mechanical deformationStructural health monitoring, vehicle crash testing
Piezoelectric SensorsCrystal elements generating voltage under mechanical stressHigh-frequency vibration analysis, weapon system monitoring
Magnetic SensorsElectromagnetic induction for shock detectionRailway vibration monitoring, seismic activity detection

3. Structure & Components

Typical shock sensor construction includes: 1) Sensing element (MEMS structure, piezoelectric crystal, or strain gauge), 2) Signal conditioning circuitry (amplifiers, filters), 3) Housing (metallic or polymer enclosure for environmental protection), 4) Electrical interface (wired connectors or wireless transceivers). High-performance variants incorporate hermetic sealing for extreme environments and integrated microcontrollers for signal processing.

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement RangeMaximum/minimum detectable acceleration ( 2g to 5000g)Determines sensor suitability for specific shock severity
Frequency ResponseOperating bandwidth (0.5Hz-10kHz typical)Affects transient event capture accuracy
ResolutionMinimum detectable change (0.01g-0.1g)Impacts measurement precision
Shock Survival RatingMaximum non-destructive input levelEnsures device durability in extreme conditions
Operating TemperatureFunctional range (-55 C to +125 C)Environmental reliability indicator
Output TypeAnalog voltage/digital (I2C, SPI, CAN)System integration compatibility

5. Application Fields

Primary industries include: Automotive (airbag triggering, crash diagnostics), Industrial (machinery condition monitoring, pipeline integrity), Consumer Electronics (mobile device drop detection), Aerospace (flight recorder activation), Security (asset tracking, tamper alarms), Medical (implantable device monitoring). Typical equipment: Automotive crash test dummies, structural health monitoring systems, package tracking devices.

6. Leading Manufacturers & Products

ManufacturerProduct SeriesKey Features
Analog DevicesADXL3753-axis MEMS, 2000Hz bandwidth, automotive qualified
TE ConnectivityEPIC SeriesHermetic sealing, 5000g range, MIL-STD-810G
PCB Piezotronics356A15Piezoelectric, 10kHz response, -55 C to +160 C
STMicroelectronicsLSM6DSOXMEMS with AI edge processing, 6.5kHz ODR
Kistler Group8692CHigh-precision charge output, 0.1-10000Hz

7. Selection Recommendations

Key considerations: 1) Required measurement range vs. expected shock levels, 2) Environmental conditions (temperature, humidity), 3) Frequency response matching application dynamics, 4) Output compatibility with existing systems, 5) Mounting constraints (PCB footprint, weight), 6) Calibration traceability (ISO 17025 requirements), 7) Cost vs. performance trade-offs. For example, MEMS sensors suit low-g consumer applications while piezoelectric types handle high-frequency industrial shocks.

8. Industry Trends

Current developments focus on: Miniaturization via advanced MEMS fabrication, Wireless sensor integration with BLE/LoRa protocols, Edge AI processing for anomaly detection, Improved temperature stability through material innovation, Multi-axis sensing in compact packages, Enhanced durability for harsh environments (IP68+, radiation resistance). Market growth driven by automotive safety regulations (ISO 26262) and predictive maintenance adoption across industries.

RFQ BOM Call Skype Email
Top