| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
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Woodhead - Molex |
IO:DNET:IP67:60MM:8P:M12:16DI:NP |
0 |
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Woodhead - Molex |
CONNECTOR |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Woodhead - Molex |
DIGITAL MOD 8PORT 14IN 2OUT NPN |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Woodhead - Molex |
TOP MOUNT 8 PORT NO LED 5M PUR |
0 |
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Woodhead - Molex |
IO;EIQC;IP67;60MM;8P5;8DI/8DO;PN |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Woodhead - Molex |
MPIS M8 PNP 3P 10PT BK 15M SGL |
0 |
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Woodhead - Molex |
CONNECTOR |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Woodhead - Molex |
CONN HEADER |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Woodhead - Molex |
TOP MOUNT BOX W/CONN |
0 |
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Woodhead - Molex |
CONN MPIS M12 5P 8PT M23 |
0 |
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Woodhead - Molex |
MPIS M8 PNP 3P 10PT M16 BK SGL |
0 |
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Woodhead - Molex |
CONN TOP MNT 4 PORT NO LED 10M P |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Woodhead - Molex |
CONNECTOR MPIS |
0 |
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Sensor Interface - Junction Blocks are critical components that serve as intermediaries between sensors/transducers and control systems. They provide electrical connectivity, signal conditioning, and environmental protection. These junction blocks enable seamless integration of diverse sensor types into industrial networks, ensuring reliable data acquisition and system interoperability. Their importance has grown with Industry 4.0 adoption, where precise data transmission and system integration are paramount.
| Type | Functional Features | Application Examples |
|---|---|---|
| Signal Conditioning Junction Blocks | Integrate amplification, filtering, and linearization circuits | Vibration sensors in turbine monitoring |
| Multi-channel I/O Junction Blocks | Support parallel signal processing with isolation barriers | Automated test equipment in semiconductor manufacturing |
| Explosion-proof Junction Blocks | ATEX/IECEx certified enclosures for hazardous areas | Gas detection systems in offshore platforms |
| Wireless Interface Junction Blocks | Integrate Bluetooth/Wi-Fi modules for IoT connectivity | Remote condition monitoring in wind farms |
| Modular Junction Systems | Customizable slots for mixed signal types (analog/digital) | Flexible production lines in automotive assembly |
Typical construction includes: - Die-cast aluminum or polycarbonate housing with IP65-IP68 protection - Gold-plated copper alloy contact elements - Integrated PCB with signal processing circuits - Terminal blocks with screw/strain relief mechanisms - Optional DIN rail mounting or panel-mount configurations - Environmental seals and cable gland entries - Diagnostic LEDs for connection status indication
| Parameter | Typical Range | Importance |
|---|---|---|
| Operating Temperature | -40 C to +85 C | Determines environmental suitability |
| Voltage Range | 12-24V DC (can extend to 250V AC) | Defines power compatibility |
| Signal Bandwidth | DC to 100kHz | Affects data transmission speed |
| Insulation Resistance | >100M at 500V DC | Ensures electrical safety |
| EMC Compliance | IEC 61000-6-2 | Guarantees noise immunity |
| MTBF | 50,000-100,000 hours | Impacts system reliability |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Phoenix Contact | PT 12-KP-EX-S | ATEX-certified, 4-channel intrinsically safe interface |
| Harting | Han-Modular Sensor | Modular hybrid connector system |
| TE Connectivity | DEUTSCH DTM Series | Military-grade environmental resistance |
| Siemens | ET 200SP HA | IP67-rated for process instrumentation |
| Balluff | BNI IOL-312 | IO-Link master with 8-port distribution |
Key considerations include: - Environmental conditions (temperature, humidity, vibration) - Signal type compatibility (voltage/current/frequency) - Required certifications (ATEX, UL, CSA) - Scalability for future system expansion - Diagnostic capabilities for predictive maintenance - Cable entry orientation and space constraints
Current trends include: - Integration of IIoT protocols (OPC UA, MQTT) - Miniaturization with increased channel density - Embedded diagnostics and self-calibration functions - Adoption of Time-Sensitive Networking (TSN) standards - Increased adoption of fiber-optic interfaces for EMI-prone environments - Development of energy-harvesting junction blocks for wireless sensor networks
Market forecasts predict 7.2% CAGR through 2027, driven by smart factory implementations and predictive maintenance adoption.