| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Seeed |
SENSOR OPTICAL MODULE SLOT TYPE |
0 |
|
Slot-type photointerrupters with logic output are optoelectronic sensors consisting of a light emitter (usually infrared LED) and a photodetector (phototransistor or photodiode) aligned in a U-shaped housing. When an object interrupts the light beam between the slot, the sensor generates a logic-level output signal. These devices are critical in industrial automation, consumer electronics, and medical equipment for position detection, motion control, and object counting.
| Type | Functional Features | Application Examples |
|---|---|---|
| Transmissive Slot Type | Direct light beam interruption detection | Encoder position detection |
| Reflective Slot Type | Detects reflected light from target objects | Color mark sensing in printing machines |
| Logic Output Variant | Integrated comparator circuit for digital output | Industrial safety interlocks |
Typical construction includes: - Infrared LED emitter (850-940nm wavelength) - Phototransistor detector with built-in amplifier - Plastic housing forming mechanical slot (0.5-10mm width) - Integrated circuit for signal conditioning - Lead frame for PCB mounting (through-hole or SMD)
| Parameter | Typical Value | Importance |
|---|---|---|
| Slot Width | 2.0 - 8.0 mm | Determines target object size detection |
| Response Time | 2 - 20 s | Crucial for high-speed applications |
| Output Type | NPN/PNP Open Collector | Compatibility with control systems |
| Current Transfer Ratio | 100-600% | Signal strength and reliability |
| Operating Temperature | -40 C to +85 C | Environmental durability |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Omron | EE-SX671 | Miniature slot (1.7mm), 10 s response time |
| Vishay | VESPE-2020 | High-temperature resistance (-40 C to +125 C) |
| STMicroelectronics | VN8905 | Integrated logic output with hysteresis |
Key considerations: - Required slot width vs target object dimensions - Environmental factors (dust, vibration, temperature) - Electrical compatibility with host system - Mechanical mounting constraints (through-hole vs SMD) - Required detection speed and output response time - EMI/RFI immunity for industrial environments
Current developments include: - Miniaturization for mobile device integration - Smart sensors with embedded diagnostics - Wireless-enabled models for IoT applications - Improved optical efficiency through GaAlAs LEDs - Multi-channel integration for parallel detection