Optical Sensors - Photoelectric, Industrial

Image Part Number Description / PDF Quantity Rfq
K50APFF100GYCQPMA

K50APFF100GYCQPMA

Banner Engineering

EZ-LIGHT 2CLR TOUCH SEN PNP NO

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QS18AB6AFF200Q5

QS18AB6AFF200Q5

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WORLD-BEAM: ADJUSTABLE FIELD FOR

2

Q12AP6FF30Q3

Q12AP6FF30Q3

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PHOTO SEN 30MM LO PNP

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SE61EMHS

SE61EMHS

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PHOTO SEN HI SPD EMITTER

18

QS18VP6AF300Q5

QS18VP6AF300Q5

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SEN BACK SUPP 30-300MM PNP

6

SM312FPQDP

SM312FPQDP

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MINI-BEAM: PLASTIC FIBER OPTIC<B

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Q25SN6LP

Q25SN6LP

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EZ-BEAM Q25 SERIES: POLARIZED RE

2

QS30EXQ

QS30EXQ

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PHOTO SEN EMITTER 213M

2

Q60BB6LAF1400

Q60BB6LAF1400

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Q60 SERIES: ADJUSTABLE-FIELD LAS

2

Q20EQ5

Q20EQ5

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PHOTO SEN EMITTER 12M

3

PVL500NQ

PVL500NQ

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PVL ARRAY SERIES: 500 MM LENGTH;

2

T18-2VPFF30IR-9M

T18-2VPFF30IR-9M

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T18-2 IR 30MM PNP 9M CABLE

0

Q20PLPQ7

Q20PLPQ7

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PHOTO SEN RETRO 4M PNP

4

SMA91EJQD

SMA91EJQD

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SMA91EJQD W/UC-900J DUST COVER A

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Q20E

Q20E

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PHOTO SEN EMITTER 12M

8

T18-2VPFF200-Q8

T18-2VPFF200-Q8

Banner Engineering

PHOTO SEN 200MM COMP PNP

1

Q12AB6FF30Q5

Q12AB6FF30Q5

Banner Engineering

PHOTO SEN 30MM LO BIPOLAR

10

S18-2VNDL-2M

S18-2VNDL-2M

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PHOTO SEN REFLECT 750MM NPN

4

SM312DQD

SM312DQD

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PHOTO SEN DIFFUSED 380MM BIPOLAR

8

SM31EL

SM31EL

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MINI-BEAM EMITTER 30M

22

Optical Sensors - Photoelectric, Industrial

1. Overview

Industrial photoelectric sensors are optoelectronic devices that detect the presence or absence of objects by emitting and receiving light beams. These sensors convert optical signals into electrical signals through photodetection mechanisms, enabling non-contact measurement and control in industrial environments. Their importance lies in enabling automation, improving production efficiency, and ensuring process reliability across various sectors including manufacturing, logistics, and quality control.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Through-Beam SensorsSeparate emitter and receiver units for high detection accuracyConveyor belt object counting
Reflective SensorsSingle unit with reflector for compact installationsPackaging integrity verification
Diffuse SensorsObject-reflective detection without separate reflectorColor contrast detection in sorting systems
Fiber Optic SensorsFlexible light transmission for confined spacesSemiconductor manufacturing equipment
Slot SensorsU-shaped design for precise positional detectionPrinted circuit board alignment systems

3. Structure and Components

Typical construction includes: 1) Light source (LED/Laser diode) emitting specific wavelengths (660nm-950nm) 2) Photodetector (photodiode/CCD array) for signal reception 3) Signal processing circuitry with amplification and threshold detection 4) Protective housing with optical window (IP65-IP69K ratings) 5) Electrical interface (2-wire/3-wire configurations) Advanced models integrate temperature compensation and digital communication protocols (IO-Link).

4. Key Technical Specifications

ParameterSignificance
Detection RangeDetermines maximum operational distance (20mm-50m)
Response TimeMeasures detection speed (10 s-2ms)
AccuracyDefines position detection precision ( 0.02mm)
Environmental ResistanceSpecifies operating conditions (-40 C to +70 C, dust/water protection)
Output TypeIdentifies electrical interface (NPN/PNP, analog/digital)

5. Application Fields

Key industries include: - Automotive Manufacturing: Robotic welding verification - Logistics: Parcel dimension measurement systems - Food Processing: Fill-level detection in transparent containers - Electronics Assembly: Component presence verification - Medical Devices: Lab automation sample tracking Example: In automotive production lines, photoelectric sensors detect door panel alignment with 0.1mm precision at 2m/s conveyor speeds.

6. Leading Manufacturers and Products

ManufacturerCountryRepresentative Product
SiemensGermanyOBT1-16GM300-S91L
OmronJapanE3Z-T61
KeyenceJapanLKG50A-W15T
Pepperl+FuchsGermanyR2000-6
BalluffUSABOS 18M

7. Selection Recommendations

Key considerations: 1. Detection requirements: Distance, object size, and speed 2. Environmental factors: Ambient light, temperature, and contamination 3. Installation constraints: Space limitations and mounting options 4. Output requirements: Digital/analog signal compatibility 5. Cost-benefit analysis: Balancing precision with operational budgets Example: Choose fiber optic sensors for high-temperature furnace applications exceeding 100 C.

8. Industry Trend Analysis

Current development trends include: - Miniaturization through MEMS technology (sensor size reduction by 40% since 2015) - Integration of AI algorithms for adaptive threshold adjustment - Wireless communication capabilities (Bluetooth/Wi-Fi 6 adoption) - Increased sensitivity in visible light spectrum (enhanced color detection) - Growth in safety-rated sensors (SIL2/PLc compliance) Market projections indicate 8.2% CAGR through 2027 driven by Industry 4.0 adoption.

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